1990
DOI: 10.1007/bf00726543
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Preparation and electrical properties of undoped zinc oxide films by CVD

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Cited by 48 publications
(24 citation statements)
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“…It is known that the physical properties of the ZnO material strongly depend on the deposition method. Ogawa et al [10] and Natsume et al [11] reported that generally the resistivity of the films prepared by sol-gel method is sufficiently low relative to those prepared by other chemical methods like chemical vapor deposition. The application of the ZnO material for the above devices is related to the transport mechanism of charge carriers in this material.…”
Section: Introductionmentioning
confidence: 98%
“…It is known that the physical properties of the ZnO material strongly depend on the deposition method. Ogawa et al [10] and Natsume et al [11] reported that generally the resistivity of the films prepared by sol-gel method is sufficiently low relative to those prepared by other chemical methods like chemical vapor deposition. The application of the ZnO material for the above devices is related to the transport mechanism of charge carriers in this material.…”
Section: Introductionmentioning
confidence: 98%
“…Various growth techniques such as chemical vapor deposition [8], r.f. magnetron sputtering [9], pulsed laser deposition (PLD) [3], evaporation [10], spray pyrolysis [11], photo-atomic layer deposition [12], metal oxide chemical vapor deposition (MOCVD) [13], molecular beam epitaxy (MBE) [4] and sol-gel process [14] have been used for ZnO film.…”
Section: Introductionmentioning
confidence: 99%
“…However, the ZnO films with this preferred orientation also have grains with other crystal orientations, [i.e., (100) or (101)] which reduce the magnitude of the anisotropic piezoelectric and electro-optic properties. Various deposition methods for the growth of ZnO thin films can be carried out using sputter deposition [9,10], chemical vapor deposition [11], spray pyrolysis [12], pulsed laser deposition [13], sol-gel [14], and reactive evaporation [15]. Among these techniques, sputter deposition techniques, using either direct current (dc) or radio frequency (rf), are most commonly used due to the combined advantages of lower deposition temperatures, higher deposition rates, and compatibility with integrated circuit (IC) processing.…”
Section: Introductionmentioning
confidence: 99%