Preparation and Application of Modified Soybean Protein Adhesives

Abstract

In this study, a sodium hydroxide modified soybean protein adhesive (NSP adhesive) was prepared and mixed with phenol-formaldehyde (PF) resin in a ratio of 7:3 to form a compound adhesive (NSPF adhesive), and three-layer plywoods were prepared using the NSP adhesive and the NSPF adhesive. In order to understand the reactions between SP and PF resin during the curing process of NSPF adhesive, the SEM and FTIR spectra were employed to character the adhesives and the bonding strength of the plywoods was measured. The results showed that the bonding strength of the poplar plywood prepared with NSPF reached 1.00 MPa, and met type I plywood requirement in GB/T 17657-1999. There was new absorption peak appear at 1390 cm-1 in the FTIR spectra of NSPF adhesive, indicating that there were -NHCH2- structures generate in NSPF during the curing process in this research.