For developing high bonding strength and environmental-friendly wood composites, a soybean/PF resin based (SP) adhesive was investigated and applied in the manufacture of plywood. Formula of the adhesive, the thermal behavior of the adhesive, and the optimum technical parameters of the plywood manufacture were investigated. The bonding strength and formaldehyde emission of plywood bonding by the adhesive were tested according to Chinese Standards methods. The result shows: the optimum formula of SP adhesive was: soy-based adhesive was 70%, PF resin was 30%; the optimum technical parameters of the plywood manufacture were: hot-pressing temperature was 160 °C, hot-pressing time was 80 s/mm, pressure intensity was 1.2 MPa, and glue content was 160 g /m2; Properties of plywood made under the optimum technical parameters were: the bonding strength was 1.30 MPa, the formaldehyde emission was 0.32 mg/L. It completely meets the type Ⅰ plywood requirement and level E0 of formaldehyde emission.
In this study, a sodium hydroxide modified soybean protein adhesive (NSP adhesive) was prepared and mixed with phenol-formaldehyde (PF) resin in a ratio of 7:3 to form a compound adhesive (NSPF adhesive), and three-layer plywoods were prepared using the NSP adhesive and the NSPF adhesive. In order to understand the reactions between SP and PF resin during the curing process of NSPF adhesive, the SEM and FTIR spectra were employed to character the adhesives and the bonding strength of the plywoods was measured. The results showed that the bonding strength of the poplar plywood prepared with NSPF reached 1.00 MPa, and met type I plywood requirement in GB/T 17657-1999. There was new absorption peak appear at 1390 cm-1 in the FTIR spectra of NSPF adhesive, indicating that there were -NHCH2- structures generate in NSPF during the curing process in this research.
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