1976
DOI: 10.1149/1.2132908
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Preferential Etching of GaAs Through Photoresist Masks

Abstract: The citric acid‐hydrogen peroxide‐water system has been developed for preferential etching of normalGaAs through photoresist masks. Etching rates depend strongly on the composition of the solution and on the crystal orientation of normalGaAs , with the rates in the order (111)B > (100) > (111)A. Flat‐bottomed holes were obtained for all compositions of the solutions. The solution does not erode photoresist masks, thereby providing preferential etching of normalGaAs through such masks.

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Cited by 58 publications
(24 citation statements)
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“…An etching solution of citric acid, hydrogen peroxide, and water was used. 4 After contacting and mesa etching, the samples were cooled close to liquid nitrogen temperature and then heated up to well above room temperature at a slow rate of 1°C/min by scanning the set point of a temperature controller. The conductance at zero bias was measured by a four-wire method and lock-in technique.…”
Section: Methodsmentioning
confidence: 99%
“…An etching solution of citric acid, hydrogen peroxide, and water was used. 4 After contacting and mesa etching, the samples were cooled close to liquid nitrogen temperature and then heated up to well above room temperature at a slow rate of 1°C/min by scanning the set point of a temperature controller. The conductance at zero bias was measured by a four-wire method and lock-in technique.…”
Section: Methodsmentioning
confidence: 99%
“…Sublattice reversal was also con®rmed by orientationdependent preferential etching [14]. Pro®les of (100) GaAs etched in an H 2 SO 4 :H 2 O 2 :H 2 O (8:1:1) solution through photoresist mask stripes are dependent on the stripe direction as shown in Fig.…”
Section: Gaas/si/gaas Sublattice Reversal Epitaxymentioning
confidence: 84%
“…Although the Caro's solution is widely used as preferential etch, in the highly diluted present composition it is nearly isotropic [20]. (3) Citric acid etch (C 6 H 8 O 7 :H 2 O 2 :H 2 O, 5:1:100, etching time 2 min at 23 • C, {100} etch rate 20 nm/min) is known as anisotropic and to be particularly gentle with respect to a photoresist mask [21]. Unlike the concentrated etch (5:1:Y with Y<1) the highly diluted etch (Y=100) is nonselective on GaAs compared with AlGaAs [22].…”
Section: Methodsmentioning
confidence: 99%