Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing

Pan, Bo; Kang, Renke; Guo, Jiang; Fu, Haiyang; Du, Dongxing; Kong, Jinxing

doi:10.1016/j.jmapro.2019.05.035

Cited by 41 publications

(14 citation statements)

References 22 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The experimental parameters are shown in Table 1. Because the stress was uniformly distributed in the surface and the depth of the stress layer is small (about 20 μm) [3], the residual stress of the machined surface is measured by XRD (μ-X360s by Pulstec, Japan). The position of measurement and results are shown in Figure 5.…”

Section: Machining Stressmentioning

confidence: 99%

“…As a di cult-to-cut material, there are many problems in using traditional processing methods. Therefore, double-sided lapping has gradually become one of the key processing methods in precision machining due to its high removal rate, good atness, high parallelism and low stress introduction [3]. However, since the pure copper thin substrate is sensitive to stress, warping deformation may occur during the processing, resulting in deterioration of workpiece atness.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

A Research on Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping

Guo¹,

He²,

Wang³

et al. 2021

Preprint

Self Cite

View full text Add to dashboard Cite

Double-sided lapping is an ultra-precision machining method capable of obtaining high-precision surface. However, during the lapping process of thin pure copper substrate, the workpiece will be warped due to the influence of residual stress-related, including the processing stress and initial residual stress, which will deteriorate the flatness of the workpiece and ultimately affect the performance of components. In this study, finite element method (FEM) was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping. Considering the initial residual stress of the workpiece, the stress caused by the lapping and their distribution characteristics, a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters. The results showed that the primary cause of the warping deformation of the workpiece in the double-sided lapping is the redistribution of initial residual stress caused by uneven removal of double-sided material. The finite element simulation results were in good agreement with the experimental results.

show abstract

Section: Machining Stressmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

A Research on Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping

Guo¹,

He²,

Wang³

et al. 2021

Preprint

Self Cite

View full text Add to dashboard Cite

show abstract

“…In addition, there are still many disadvantages such as low efficiency and uncontrollable uniformity in free grit lapping [4,5]. Double-sided planetary lapping technology with a fixed abrasive grinding pad that has a high removal rate, controllable uniformity, and that relieves uneven release of internal stress of wafer surface, which can solve many problems as mentioned above [6,7]. Thus, double-sided planetary lapping technology with a fixed abrasive grinding pad can be developed for lapping for the YAG wafer.…”

Section: Introductionmentioning

confidence: 99%

Effect of Workpiece Rotational Speed on Surface Quality in YAG Double-sided Planetary Lapping With the Trajectory Method

Yang

Guo

Kang

et al. 2022

Preprint

View full text Add to dashboard Cite

The double-sided planetary lapping technology with fixed grit is a good candidate to process thin Y3Al5O12(YAG) crystals wafer. However, the influence of workpiece rotational speed nw in the planetary wheel on grit trajectory distribution and surface quality has not been revealed, which is of most significance to obtain a better surface workpiece. To solve this problem, the mathematical model for calculating the grit trajectory left on the workpiece in double-side lapping considering the workpiece rotation is established, and a variation coefficient for uniformity of the track point distribution (NUTPD) is introduced to evaluate the trajectory uniformity. Then, the trajectory of multiple grits and the NUTPD value at different workpiece rotational speeds were simulated in MATLAB software. The simulation result showed that the workpiece rotational speed had an extraordinary effect on the uniformity of the motion trajectory leaving on the workpiece surface. The preferred workpiece rotational speed values for lapping are nw=1,3,5,7,9. By conducting a series of tests on the YAG wafer at two typically selected rotational speeds, the surface roughness Ra and the peak-to-valley (PV) error of flatness were used to characterize the uniformity of surfaces quality. The experimental results demonstrate that there was a more uniform lapping effect, when nw=5 rpm, and the Ra and PV were 147 nm, 2.62 μm, and 141 nm, 2 μm at the upper and lower surface after lapped, which was smaller. They were 161 nm, 3.05 μm, and 149 nm, 2.74 μm after lapping when nw=6 rpm. The experimental result is consistent with the simulation result, and the feasibility and validity of the trajectory method for controlling workpiece surface quality on the planetary double-side lapping were verified.

show abstract

“…Abrasive particles will leave scratches on the surface of copper alloys owing to the high normal force of conventional mechanical finishing, resulting in a poor polished surface [2]. And harmful gases are generated during the CMP process [3]. In order to overcome the disadvantages of conventional finishing technologies, many advanced finishing technologies have been applied in the finishing of copper and copper alloys.…”

Section: Introductionmentioning

confidence: 99%

Optimization of finishing parameters for magnetic compound fluid finishing (MCFF) of copper alloy

Fan

Ren²,

Pan³

et al. 2022

Int J Adv Manuf Technol

View full text Add to dashboard Cite

As an advanced finishing technology, magnetic compound fluid finishing (MCFF) is considered to be able to achieve damagefree finishing of low-hardness materials such as copper alloys with appropriate finishing parameters. However, ignoring the influence of the material removal amount on the dimensional accuracy when optimizing the finishing parameters may result in excessive material removal and a reduction in the workpiece's dimensional accuracy. Thus, a novel finishing parameters optimization method considering dimensional accuracy is proposed in this paper. Firstly, the MCFF experiments are planned and carried out for modeling. Secondly, a MCFF model is established based on the integrated learning theory. The established model is a multi-layer neural network fusion model comprised of a prediction layer and a fusion layer, which can accurately predict the polished surface quality and material removal amount. Thirdly, taking the effect of material removal amount on the dimensional accuracy into account, the finishing parameters are optimized by the multi-objective particle swarm optimization algorithm. Finally, the model's prediction accuracy and the superiority of the optimized parameters are compared and verified by experiments. The results demonstrate that the developed model can correctly predict the finishing effect, and the high-quality polished surfaces and high dimensional accuracy can be obtained with the optimized finishing parameters.

show abstract

Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing

Cited by 41 publications

References 22 publications

A Research on Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping

A Research on Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping

Effect of Workpiece Rotational Speed on Surface Quality in YAG Double-sided Planetary Lapping With the Trajectory Method

Optimization of finishing parameters for magnetic compound fluid finishing (MCFF) of copper alloy

Contact Info

Product

Resources

About