Precise Patterning of Organic Semiconductor Crystals for Integrated Device Applications

Abstract

Development of high‐performance organic electronic and optoelectronic devices relies on high‐quality semiconducting crystals that have outstanding charge transport properties and long exciton diffusion length and lifetime. To achieve integrated device applications, it is a prerequisite to precisely locate the organic semiconductor crystals (OSCCs) to form a specifically patterned structure. Well‐patterned OSCCs can not only reduce leakage current and cross‐talk between neighboring devices, but also facilely integrate with other device elements and their corresponding interconnects. In this Review, general strategies for the patterning of OSCCs are summarized, and the advantages and limitations of different patterning methods are discussed. Discussion is focused on an advanced strategy for the high‐resolution and wafer‐scale patterning of OSCC by a surface microstructure‐assisted patterning method. Furthermore, the recent progress on OSCC pattern‐based integrated circuities is highlighted. Finally, the research challenges and directions of this young field are also presented.

Sub‐Femtojoule‐Energy‐Consumption Conformable Synaptic Transistors Based on Organic Single‐Crystalline Nanoribbons

“…Inspired from its high‐efficiency and barrier‐free transmission, we first utilize OSCNR as active layer to construct organic synaptic transistors. Quite different from organic thin film, OSCNR is highly ordered without grain boundary, [ 41,42 ] which is conducive to lossless transmission of charge carriers and the realization of ultralow‐energy‐consumption artificial synapses. The structure schematic of the fabricated OSCNR synaptic transistor is shown in Figure 1b.…”

Solution‐Processed Centimeter‐Scale Highly Aligned Organic Crystalline Arrays for High‐Performance Organic Field‐Effect Transistors

“…The insulating polymer acts as a binder to help overcome the dewetting challenge associated with small‐molecule OSC solution processing and to achieve highly crystalline and uniform thin films over large areas 18–20. Additionally, these applications also require the deposition of OSCs in a patterned structure for fabrication of device arrays, which could be beneficial for further high levels of integration, because patterning of the semiconductor layer can effectively reduce the cross‐talk between devices 21. Unlike inorganic semiconductors, most of the OSCs are not stable when exposed to strong UV light, organic solvents, or high temperatures, which result in an incompatibility with conventional photolithography techniques 22,23.…”

“…www.advmat.de www.advancedsciencenews.com because patterning of the semiconductor layer can effectively reduce the cross-talk between devices. [21] Unlike inorganic semiconductors, most of the OSCs are not stable when exposed to strong UV light, organic solvents, or high temperatures, which result in an incompatibility with conventional photolithography techniques. [22,23] Despite many efforts over the past decade to fabricate patterned large-area OSC arrays, such as inkjet printing, [24] contact evaporation printing, [25] and capillary-bridge lithography, [26] these methods still involved photolithography to create the wetting/dewetting areas, or the contact template, which diminishes the advantages of the solution process.…”

IR Artificial Compound Eye

“…Recently, maskless 3D micro‐manufacturing based on femtosecond lasers seems promising in high‐quality micro‐optics fabrication on the free‐form surface, especially such kind of ACE devices integrating massive sub‐apertures onto a macro‐dome surface . In this work, we present a novel IR ACE component which is fabricated by femtosecond laser‐assisted wet etching technique (FLWE) and 3D nano‐imprinting technique . By this strategy, the high‐quality ommatidium facets are efficiently fabricated onto a curved hard substrate, forming a highly integrated 3D compound eye mold, with ommatidium fill factor of 100%.…”

“…[6,14] In this work, we present a novel IR ACE component which is fabricated by femtosecond laser-assisted wet etching technique (FLWE) [14,18,19] and 3D nano-imprinting technique. [20][21][22] By this strategy, the high-quality ommatidium facets are efficiently fabricated onto a curved hard substrate, forming a highly integrated 3D compound eye mold, with ommatidium fill factor of 100%. The finally replicated component is featured with ultra-thin shell structure (105 ± 15 µm), ultralightweight (5 mg), high surface quality (λ/15@1064 nm), and remarkable IR radiation selectivity (780-2200 nm).…”