Proceedings of the 43rd Annual Conference on Design Automation - DAC '06 2006
DOI: 10.1145/1146909.1146964
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Power grid physics and implications for CAD

Abstract: Much research has been done lately concerning analysis and optimization techniques for on-chip power grid networks. However, all of these approaches assume a particular model or behavior of the power delivery. In this paper, we describe the first detailed full-die dynamic model of an industrial microprocessor design, including package and non-uniform decap distribution. This model is justified from the ground up using a full-wave model and then increasingly larger but less detailed models with only the irrelev… Show more

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Cited by 92 publications
(32 citation statements)
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References 11 publications
(9 reference statements)
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“…The current distribution in present chips tends to be locally uniform and globally nonuniform. This property is referred as spatial locality and is utilized in power grid design [17]- [19]. Because sleep transistors act as switches between the virtual and chip's power/ground network, the current to each logic cell is supplied by sleep transistors in its vicinity.…”
Section: (C) the Location (500500) Is Chosen As The Root Of The Kd-mentioning
confidence: 99%
“…The current distribution in present chips tends to be locally uniform and globally nonuniform. This property is referred as spatial locality and is utilized in power grid design [17]- [19]. Because sleep transistors act as switches between the virtual and chip's power/ground network, the current to each logic cell is supplied by sleep transistors in its vicinity.…”
Section: (C) the Location (500500) Is Chosen As The Root Of The Kd-mentioning
confidence: 99%
“…1) [20,21]. The horizontal and vertical segments of a grid are routed at different metal levels (e.g.…”
Section: On-chip P/g Network Modelmentioning
confidence: 99%
“…With technology scaling, power supply voltages become lower, clock rates rise, and greater functionality is integrated on-chip, significantly increasing the power dissipation [1], [2]. Faster transition times and higher current demands produce larger voltage droop due to resistive IR and inductive L di/dt noise [3].…”
Section: Introductionmentioning
confidence: 99%
“…The number of on-chip power supplies is increasing, requiring innovative design methodologies to satisfy stringent noise and power constraints of these high complexity integrated circuits [1], [2]. Placing the power supply on-chip eliminates losses due to the parasitic impedances of the package , improving the quality of the delivered power [6].…”
Section: Introductionmentioning
confidence: 99%