2021
DOI: 10.1016/j.joule.2021.02.013
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Polysilicon passivated junctions: The next technology for silicon solar cells?

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Cited by 103 publications
(84 citation statements)
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References 120 publications
(232 reference statements)
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“… 3 , 4 One of the most promising passivating contacts to rapidly bridge the gap between device efficiencies in R&D and those in production is based on a highly doped polycrystalline silicon (poly-Si) layer on top of a thin silicon oxide (SiO x ) buffer layer. 5 Due to its resilience at high temperatures, the poly-Si/SiO x contact promises compatibility with the mainstream metallization process currently used in the industry and thus a rapid increase of the c-Si solar cell efficiency beyond 24% in mass production. 5 7 …”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“… 3 , 4 One of the most promising passivating contacts to rapidly bridge the gap between device efficiencies in R&D and those in production is based on a highly doped polycrystalline silicon (poly-Si) layer on top of a thin silicon oxide (SiO x ) buffer layer. 5 Due to its resilience at high temperatures, the poly-Si/SiO x contact promises compatibility with the mainstream metallization process currently used in the industry and thus a rapid increase of the c-Si solar cell efficiency beyond 24% in mass production. 5 7 …”
Section: Introductionmentioning
confidence: 99%
“… 5 Due to its resilience at high temperatures, the poly-Si/SiO x contact promises compatibility with the mainstream metallization process currently used in the industry and thus a rapid increase of the c-Si solar cell efficiency beyond 24% in mass production. 5 7 …”
Section: Introductionmentioning
confidence: 99%
“…[ 3–5 ] Low pressure chemical vapor deposition (LPCVD) is currently the mainstream amorphous/polycrystalline silicon layer (a‐Si/poly‐Si) deposition technology used to fabricate industrial TOPCon cells. [ 6,7 ] Apart from high deposition rates, LPCVD allows in‐situ thermal oxidation of crystalline silicon (c‐Si) surface to form a tunnel oxide before deposition of poly‐Si layers in the same tube. However, since a‐Si/poly‐Si layer is inherently deposited on both sides of the wafer, a single‐sided etching (SSE) of this layer is required on the front side for typical TOPCon configuration in n‐type substrate, where the TOPCon layer is placed at the rear‐side of the cell.…”
Section: Introductionmentioning
confidence: 99%
“…[ 9 ] Physical vapor deposition (PVD) is reported to provide single‐sided poly‐Si deposition; [ 10 ] however, an industrial process is still under development. [ 7,11 ]…”
Section: Introductionmentioning
confidence: 99%
“…For commercial application of tandem solar cells, silicon solar cells should enable the manufacturing of inexpensive, mass-produced cells that tolerate high temperatures [7]. The silicon solar-cell technology that has garnered the most attention is the carrier-selective contact structure, using a thin tunnel oxide and polysilicon [8,9]. This structure was first unveiled by Fraunhofer ISE as a tunnel oxide passivated contact (TOPCon) structure, and achieved 26.0% conversion efficiency over an area of 4 cm 2 by incorporating a phosphorusdoped polysilicon layer and a passivated, thin silicon oxide (SiO 2 ) film on the silicon surface to selectively transfer electrons [10].…”
Section: Introductionmentioning
confidence: 99%