Polymer insulating films for cryotron fabrication

Allam, D. S.; Stoddart, C. T. H.; Stuart, P. R.

doi:10.1016/0026-2714(66)90006-0

Cited by 9 publications

(3 citation statements)

References 12 publications

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“…However it is difficult to understand why higher sensitivities are recorded for PPMMA because it usually has a crosslinked structure. 56 MHz,200mtorr,150 W,and 40 min. For this reason, plasma copolymers with MMA and styrene were investigated because polystyrene exhibits higher plasma etching resistance.…”

Section: A Plasma Polymerized Resistsmentioning

confidence: 99%

Applications of Plasma Polymers

Morita

Hattori

1990

Plasma Deposition, Treatment, and Etching of Polymers

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Section: A Plasma Polymerized Resistsmentioning

confidence: 99%

Applications of Plasma Polymers

Morita

Hattori

1990

Plasma Deposition, Treatment, and Etching of Polymers

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“…In the first group, the two conductors are in intimate contact with the dielectric. Materials such as organic photoresist [41], silicon monoxide [42], silicon dioxide [43], and various glasses [44] have been used as the dielectric. A detailed study using Si0 and various metal combinations was made by Richardson et al [42].…”

Section: Substratesmentioning

confidence: 99%

Interconnection systems for solid-state components in hybrid integrated circuits

Basseches¹

1971

Proc. IEEE

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The factors which can influence the performance and reliability of the interconnection system for solid-state components in hybrid integrated circuits are examined. The main emphasis is on materials that have received most attention in the tantalum film and silicon technologies in the Bell System. However, other materials that are being used are discussed. The interrelation of various factors in choosing an interconnection system is discussed. These factors include the composition of the materials, the methods of depositing various metals, and the properties of the substrates. Among the properties of the materials that are considered. emphasis is laid on environmental stability. The results of environmental tests on conductors and thin-film resistors under high-humidity conditions are reported. Some results on the use of silicone rubber as an encapsulant indicate this material is effective in reducing degradative action on hybrid circuits.

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“…As the silicones are among the more chemically stable classes of compounds, cross-linking of a few kinds of silicones by electron beam irradiation was tried for the formation of the etch-resists. Although some experiments have been done to form silicone films by electron beam irradiation, their processes were fairly slow since silicones were supplied onto the surface of substrate from vapor phase along with electron bombardment (3)(4)(5)(6)(7)(8)(9)(10)(11). In other experiments the precoated organosilicon compound, triphenylsilanol, was polymerized by electron beam, but its sensitivity was also low (12)(13).…”

mentioning

confidence: 99%

Electron Beam Exposure of Silicones

Yatsui

Nakata

Umehara

1969

J. Electrochem. Soc.

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An investigation has been carried out on silicone etch-resists which can be exposed by electron beam irradiation. Thin silicone films with a thickness of about 5000 and 10,000A were irradiated by scanning electron beam accelerated at 10 and 25 kv, over defined area. The thicknesses of silicone films after development were measured for each different irradiation charge density; thus the exposure characteristics of a few kinds of silicones were obtained. With the most sensitive silicone, methylvinylpolysiloxane, it was possible to form developed pattern with irradiation charge density 8.8 x 10 -7 coulombs/cm ~ at 10 kv. The chemical resistances of the electron beam irradiated silicone films to the chemical reagents which were thought to be the constituents of common etchants were also investigated. It has been shown that flood-beam irradiation onto the developed silicone films was effective to increase chemical resistance and adhesive force to the substrate. Such silicone resists are practically useful to almost all etchants other than sulfuric acid.

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Polymer insulating films for cryotron fabrication

Cited by 9 publications

References 12 publications

Applications of Plasma Polymers

Applications of Plasma Polymers

Interconnection systems for solid-state components in hybrid integrated circuits

Electron Beam Exposure of Silicones

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