2021
DOI: 10.1021/acsaelm.1c00107
|View full text |Cite
|
Sign up to set email alerts
|

Polymer-Embedded Silver Microgrids by Particle-Free Reactive Inks for Flexible High-Performance Transparent Conducting Electrodes

Abstract: We report on the fabrication and characterization of polymer-embedded silver (Ag) microgrid structures using a particle-free reactive Ag ink for flexible high-performance transparent conductive electrodes. The Ag microgrids are cured at low temperatures and embedded directly into flexible polyethylene terephthalate (PET) films to create structures needed for high transparency and low sheet resistance. The conductive grids demonstrate 91.8% transmission and a sheet resistance of 0.88 Ω/sq corresponding to an op… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
9
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
7
1

Relationship

2
6

Authors

Journals

citations
Cited by 15 publications
(9 citation statements)
references
References 45 publications
0
9
0
Order By: Relevance
“…High-cost sputtering deposition techniques combined with finite indium resources are key limitations towards scale-up potential, while its mechanical brittleness has made it a poor candidate for printable electronics. [9][10][11] Several viable flexible TCE alternative materials such as graphene, [12][13][14] carbon nanotubes, [12,[14][15][16] metallic nanowires, [17,18] metallic grids, [6,19,20] and hybrid films [21][22][23][24][25] have emerged to circumvent the challenges of ITO electrodes in device architectures. Silver metallic microgrids hold great potential as flexible TCEs due to their high degree of geometric tunability and versatility of available ink formulations compatible with high volume printing techniques such as screen-printing.…”
mentioning
confidence: 99%
“…High-cost sputtering deposition techniques combined with finite indium resources are key limitations towards scale-up potential, while its mechanical brittleness has made it a poor candidate for printable electronics. [9][10][11] Several viable flexible TCE alternative materials such as graphene, [12][13][14] carbon nanotubes, [12,[14][15][16] metallic nanowires, [17,18] metallic grids, [6,19,20] and hybrid films [21][22][23][24][25] have emerged to circumvent the challenges of ITO electrodes in device architectures. Silver metallic microgrids hold great potential as flexible TCEs due to their high degree of geometric tunability and versatility of available ink formulations compatible with high volume printing techniques such as screen-printing.…”
mentioning
confidence: 99%
“…Preliminary data indicate that printing with thinner needles or using a printer with higher stage accuracy can decrease the line width to ∼75 μm (Figure S10). Additionally, recent reports have used RSI in nanowire transparent conducting electrodes that show line widths as low as 180 nm to 3.5 μm. …”
Section: Resultsmentioning
confidence: 99%
“…Some other examples are inkjet-printed MOD inks, which take advantage of high precision nozzle sizes and control over deposition parameters such as droplet size and speed to fabricate fine line transparent conductive electrodes or using photolithography to create highly conductive and mechanically stable TCE architectures. Additional features are summarized in Table .…”
Section: Properties and Applicationsmentioning
confidence: 99%