Silver is the most expensive non-silicon component in photovoltaic cells. This is particularly salient for silicon heterojunction (SHJ) cells, which rely on large quantities of low-temperature silver pastes (LT-SP). SHJ cells would benefit greatly from an industrially scalable metallization process that simultaneously offers low silver consumption, low finger resistivities (<20 μΩ·cm), and low processing temperatures. Printed reactive silver inks (RSI) are an innovative candidate to this end. This work furthers the research on RSI metallization by investigating the impact of ink formula on properties pertinent to SHJ cells, including electrical properties, line width, ink splatter, silver consumption, cell performance, and adhesion. We introduce a scalable, high-throughput flexible needle contact printing approach for metallization that solves many of the issues associated with drop-on-demand printing. The printed silver fingers are characterized using electrical measurements and top-down and cross-sectional microscopy. The best performing ink, consisting of silver acetate, ethylamine, and formic acid, achieved silver fingers with total resistivities of 3.1 μΩ·cm and contact resistivities of 3.2 mΩ·cm2 when printed at 61 °C. This ink metallized a full-sized 156 mm × 156 mm SHJ cell. This is the first reported data for RSI metallization of a full-sized SHJ cell and shows how an optimized RSI can achieve similar performances to LT-SP while consuming 80–90% less silver.

Transparent conducting electrodes (TCEs) are essential components in devices such as touch screens, smart windows, and photovoltaics. Metal nanowire networks are promising next-generation TCEs, but best-performing examples rely on expensive metal catalysts (palladium or platinum), vacuum processing, or transfer processes that cannot be scaled. This work demonstrates a metal nanowire TCE fabrication process that focuses on high performance and simple fabrication. Here we combined direct and plating metallization processes on electrospun nanowires. We first directly metallize silver nanowires using reactive silver ink. The silver catalyzes subsequent copper plating to produce Ag–Cu core–shell nanowires and eliminates nanowire junction resistances. The process allows for tunable transmission and sheet resistance properties by adjusting electrospinning and plating time. We demonstrate state-of-the-art, low-haze TCEs using an all-atmospheric process with sheet resistances of 0.33 Ω sq−1 and visible light transmittances of 86% (including the substrate), leading to a Haacke figure of merit of 652 × 10–3 Ω−1. The core–shell nanowire electrode also demonstrates high chemical and bending durability.

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The sulfidation kinetics of titanium and Ti-6Al-4V (Ti64) using elemental sulfur were studied by measuring the amount of metal consumed instead of the change in mass or scale thickness. This metal consumption approach combines the parabolic oxidation law, Arrhenius equation, and Pilling-Bedworth ratio to determine the apparent activation energy and the pre-exponential factor of consumption of Ti64 during sulfidation. The estimations of apparent activation energy and preexponential factor were 110.4 kJ•mol −1 and 1.3 × 10 −9 m 2 s −1 for the titanium-sulfur, and 116.2 kJ•mol −1 and 1.2 × 10 −9 m 2 s −1 for the Ti64-sulfur system. Finally, a material removal predictor was developed to predict the amount of Ti64 consumed for a given sulfidation temperature and time.

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