Advanced Applications of Metal–Organic Decomposition Inks in Printed Electronics

Kell, Arnold J.; Wagner, Kaitlin; Liu, Xiangyang; Lessard, Benoît H.; Paquet, Chantal

doi:10.1021/acsaelm.3c00910

Cited by 2 publications

(1 citation statement)

References 86 publications

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“…For even narrower layouts, femtoliter print heads or other digital printing technologies like Aerosol Jet, microdispensing or electrohydroninamic printing can be utilized. Depending on the printing technology, line widths of around 1 µm can be achieved [8].…”

Section: Introductionmentioning

confidence: 99%

Inkjet-printed low temperature co-fired ceramics: process development for customized LTCC

Jäger,

Ihle,

Gläser

et al. 2024

Flex. Print. Electron.

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This paper investigates the utilization of digital printing technologies for the fabrication of low temperature co-fired ceramics (LTCC). LTCC offer great opportunities for applications such as antennas, sensors or actuators due to their outstanding properties like low dielectric loss, low permittivity, low coefficient of thermal expansion and at the same time high reliability in harsh environments (heat, humidity, and radiation). LTCC are multilayer circuits that are typically functionalized by screen-printing. This publication investigates the replacement of screen-printing by digital printing processes, such as inkjet and Aerosol Jet printing, to facilitate a more resource-friendly and customizable manufacturing of LTCC. The use of digital printing technologies not only streamlines small-scale productions and development processes but also offers the advantage of achieving miniaturization down to single-digit microns. In this publication, digital printing processes, filling of vias, lamination processes, co-firing at 850 °C and printing on fired LTCC were investigated. Three layers of nanoparticle silver ink were printed on green LTCC tape and 100% of the embedded printed structures were conductive after co-firing. Filling of vias with inkjet printing was investigated and the most important process parameters were found to be the clustering of vias, the amount of active nozzles and the substrate temperature. Printing on fired LTCC demonstrated high precision, and sintering at 600 °C achieved strong adhesion of printed structures to LTCC. These successful findings culminate in presenting a process chain for fully maskless structured, multilayer LTCC.

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Section: Introductionmentioning

confidence: 99%

Inkjet-printed low temperature co-fired ceramics: process development for customized LTCC

Jäger,

Ihle,

Gläser

et al. 2024

Flex. Print. Electron.

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Molecular approach to semiconductors: a shift towards ecofriendly manufacturing and neuroinspired interfaces

Monakhov,

Meinecke,

Moors

et al. 2024

Pure and Applied Chemistry

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Energy dissipation through physical downscaling towards more complex types of memory and logic devices, loss of ultrapure water and consumption of large amounts of (toxic) chemicals for wafer cleaning processes, as well as high thermal budget of solid-state synthesis and thin film growth of standard semiconductors including the use of rare earth elements – all this poses great challenges for semiconductor materials science and technology. Therefore, research and development of alternative methods for micro- and nanofabrication and chemical functionalization of a new type of resource- and energy-efficient semiconductors as the core component of every computer chip is crucial. One of the promising opportunities is the transformation of today’s complementary metal-oxide-semiconductor (CMOS) electronics into ecofriendly and neuroinspired electronics driven by molecular design and multi-level switching mechanisms at room temperature. The sustainable chemical technology of electron transport and switching materials in semiconductor manufacturing and the development of devices with new unconventional nanophysics, improved performance, and augmented functionalities (beyond-CMOS and More-than-Moore) is becoming increasingly important in the context of a gradual transition to a future-oriented concept of Internet of Everything (IoE). In this article, we focus on the technological significance of semiconductor preparation from single-source (molecular) precursors and the prospect of functionalizing semiconductors using DNA origami nanotechnology and stimuli-responsive metal–oxygen cluster ions such as polyoxometalates (POMs). We also describe the advanced characterization of these qualified molecular systems by soft X-rays. We emphasize the technical relevance of using solution-based methods for the bottom-up preparation of novel and hybrid semiconductors as well as their challenging scalability and the compatibility of methods of molecular technology with lithography-based mass production. Our article aims to contribute to the achievement of the United Nations’ Sustainable Development Goal 9 (Industry, Innovation and Infrastructure).

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Advanced Applications of Metal–Organic Decomposition Inks in Printed Electronics

Cited by 2 publications

References 86 publications

Inkjet-printed low temperature co-fired ceramics: process development for customized LTCC

Inkjet-printed low temperature co-fired ceramics: process development for customized LTCC

Molecular approach to semiconductors: a shift towards ecofriendly manufacturing and neuroinspired interfaces

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