Plasmachemical Conservation of Corroded Metallic Objects

Sazavska, Vera; Balastikova, Radka; Krčma, František; Řádková, Lucie; Fojtíková, Petra; Přikryl, Radovan; Procházka, Michal

doi:10.1088/1742-6596/715/1/012012

Cited by 5 publications

(7 citation statements)

References 8 publications

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“…Wave numbers above 3000 cm −1 (3020 cm −1 ) are assigned to aromatic, whereas wave numbers below 3000 cm −1 (2865 cm −1 , 2928 cm −1 ) are assigned to aliphatic C−H stretching vibrations [ 56 , 57 ]. However, since the wave number of 3020 cm −1 is very close to the 3000 cm −1 limit, other scientific literature assigns it to C−H aliphatic stretching as well [ 42 , 53 ].…”

Section: Resultsmentioning

confidence: 99%

“…However, since the wave number of 3020 cm −1 is very close to the 3000 cm −1 limit, other scientific literature assigns it to C−H aliphatic stretching as well [ 42 , 53 ]. Wave numbers of 1897 cm −1 , 1745 cm −1 , 949 cm −1 , 906 cm −1 , and 878 cm −1 are assigned with out-of-plane wagging of C−H bonds [ 42 , 53 , 56 ]. The peak at 1700 cm −1 can be observed due to oxidation of Parylene C and represents the formation of carbonyl bonds [ 32 , 42 , 53 ].…”

Section: Resultsmentioning

confidence: 99%

“…C=C stretching vibrations in the aromatic ring are assigned to 1558 cm −1 and 1610 cm −1 , whereas semicircle stretching is assigned to 1341 cm −1 , 1404 cm −1 , and 1495 cm −1 , respectively [ 42 , 53 ]. Several absorptions bands are assigned to the p -CH 2 groups on the aromatic ring: 1077 cm −1 , 1110 cm −1 , 1158 cm −1 , 1210 cm −1 , and 1267 cm −1 are caused by wagging [ 42 , 53 ], whereas 1452 cm −1 can be assigned either to CH 2 deformation [ 42 , 53 ] or to the bonding of this group to the ring [ 56 ]. C−C aromatic and aliphatic stretching vibrations are assigned to 1493 cm −1 and 826 cm −1 , respectively [ 57 ].…”

Section: Resultsmentioning

confidence: 99%

“…C−C aromatic and aliphatic stretching vibrations are assigned to 1493 cm −1 and 826 cm −1 , respectively [ 57 ]. However, the band at 826 cm −1 can also be assigned to two neighboring hydrogen atoms bonded to the ring [ 56 ]. Finally, C−H groups can be observed at 826 cm −1 with out-of-plane wagging or at 1004 cm −1 and 1050 cm −1 with in-plane bending [ 42 , 53 ].…”

Section: Resultsmentioning

confidence: 99%

“…Finally, C−H groups can be observed at 826 cm −1 with out-of-plane wagging or at 1004 cm −1 and 1050 cm −1 with in-plane bending [ 42 , 53 ]. Additionally, the absorption band at 1050 cm −1 is characteristic for the chlorine bonded to the aromatic ring in Parylene C [ 56 ].…”

Section: Resultsmentioning

confidence: 99%

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Impact of Non-Accelerated Aging on the Properties of Parylene C

et al. 2022

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The polymer Parylene combines a variety of excellent properties and, hence, is an object of intensive research for packaging applications, such as the direct encapsulation of medical implants. Moreover, in the past years, an increasing interest for establishing new applications for Parylene is observed. These include the usage of Parylene as a flexible substrate, a dielectric, or a material for MEMS, e.g., a bonding adhesive. The increasing importance of Parylene raises questions regarding the long-term reliability and aging of Parylene as well as the impact of the aging on the Parylene properties. Within this paper, we present the first investigations on non-accelerated Parylene C aging for a period of about five years. Doing so, free-standing Parylene membranes were fabricated to investigate the barrier properties, the chemical stability, as well as the optical properties of Parylene in dependence on different post-treatments to the polymer. These properties were found to be excellent and with only a minor age-related impact. Additionally, the mechanical properties, i.e., the Young’s modulus and the hardness, were investigated via nano-indentation over the same period of time. For both mechanical properties only, minor changes were observed. The results prove that Parylene C is a highly reliable polymer for applications that needs a high long-term stability.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

See 3 more Smart Citations

Impact of Non-Accelerated Aging on the Properties of Parylene C

et al. 2022

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Hermetic, Hybrid Multilayer, Sub‐5µm‐Thick Encapsulations Prepared with Vapor‐Phase Infiltration of Metal Oxides in Conformal Polymers for Flexible Bioelectronics

Mariello,

von Allmen,

et al. 2024

Adv Funct Materials

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Reliable long‐term function is crucial for flexible and soft bioelectronics. Mechanical defects and permeation of water molecules across the various device layers are the prime drivers of failure, and particularly in applications requiring continuous contact with biofluids (i.e. for implantable applications). To address demanding needs of miniaturization, mechanical compliance and water impermeability, ultra‐thin high‐barrier encapsulations are a promising way to improve device reliability. In this work, the encapsulation properties of vapour phase infiltration (VPI) of inorganic Al2O3 layers deposited by atomic layer deposition (ALD), as bilayers with TiO2, onto polyimide and parylene C organic substrates are investigated. The layers are grown in a single reactor and the infiltration is performed in a single process, with a resulting nanometric infiltration depth. Mechanical integrity and hermeticity are characterized through tensile fragmentation tests and accelerated aging tests. Flexible Magnesium sensors monitor water vapor permeability in situ. A remarkable improvement in the crack onset strain (∽2.56 times), interfacial shear strength (∽2.1 times), water vapour transmission rate (∽5.2 times) and lifetime performance (∽7.1 times) is achieved, compared to the non‐infiltrated ALD coatings. Pluri‐infiltrated multilayers are proposed as alternatives to conventional coatings. This work is envisioned to accelerate research progress on hermetic packaging of flexible bioelectronics.

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Low-Temperature Parylene-Based Adhesive Bonding Technology for 150 and 200 mm Wafers for Fully Biocompatible and Highly Reliable Microsystems

Selbmann

Baum

Meinecke

et al. 2021

ECS J. Solid State Sci. Technol.

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Wafer bonding is a crucial process for fabricating microsystems. Within this study, the polymer parylene was used to establish a low-temperature adhesive wafer bonding process for wafers of 150 and 200 mm diameters. The bonding process was investigated for silicon and glass wafers with different additional coatings including silicon dioxide, silicon nitride, aluminum, and parylene C. Important process parameters such as bonding temperature and time were also investigated and the parylene adhesive was analyzed in detail with respect to its dimensions and type. The performance of the parylene bonding was characterized in different aspects, including mechanical tests, cross-sectional scanning electron microscopy, infrared light transmission, and different hermeticity tests. The reliability of the parylene bonded compounds was also investigated with respect to constant loading, mechanical shocking, and thermal cycling. As a result, the parylene bonding is feasible with various materials and shows high tensile and shear strengths of up to 35 MPa and 80 MPa, respectively. Hermeticity was excellent, with a helium leakage rate lower than 10‒7 mbar∙l s−1. The parylene bonded compounds were proven to feature high reliability. Finally, application of the superior properties of the parylene bonding was demonstrated with respect to the fabrication of different three-dimensional structures.

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Plasmachemical Conservation of Corroded Metallic Objects

Cited by 5 publications

References 8 publications

Impact of Non-Accelerated Aging on the Properties of Parylene C

Impact of Non-Accelerated Aging on the Properties of Parylene C

Hermetic, Hybrid Multilayer, Sub‐5µm‐Thick Encapsulations Prepared with Vapor‐Phase Infiltration of Metal Oxides in Conformal Polymers for Flexible Bioelectronics

Low-Temperature Parylene-Based Adhesive Bonding Technology for 150 and 200 mm Wafers for Fully Biocompatible and Highly Reliable Microsystems

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