Planar assembled flexible interconnect link with hybrid optical/electrical data transmission for mobile device applications

Abstract

New serial data transmission standards for cameras and displays in mobile devices are demanding low power multigigabit high speed serial links which must operate in noisy RF environments.[1] To meet these requirements a hybrid optical/electrical interconnect link is proposed. By combining a traditional flexible electrical interconnect with an advanced low power optical interconnect it is possible to meet the demands of this future market. The two key developments discussed in this paper are: the electrical/optical switching system, which is the basis for the hybrid link, and the all planar assembly process, featuring an edge emitting laser diode, edge receiving photodiode and a flexible polymer waveguide.

Ultra-thin and low-power optical interconnect module based on a flexible optical printed circuit board

“…As representative techniques in this field, optical interconnect techniques have been developed using a polymeric optical waveguide, 1,2 a hybrid plasmonic waveguide, 3 a rigid, flexible optical printed circuit board (OPCB), 4-6 and a flexible OPCB. 7,8 Using an optical interconnect technique has the following advantages. First, if complex and high-density electrical wiring is replaced with serialized optical wiring, the thickness of PCB layers can be reduced and the PCB width narrowed; a small hinge structure and a slim device can thus be realized.…”