Ultra-thin and low-power optical interconnect module based on a flexible optical printed circuit board

Abstract

We describe an ultra-thin and low-power optical interconnect module for mobile electronic devices such as mobile phones and notebooks. The module was fabricated by directly packaging optic and electronic components onto a thin and flexible optical printed circuit board having a size of 70 × 8 × 0.25 mm. The completed active module has features of thinness (0.5 mm), small size (7 × 5 mm), very low total power consumption (15.88 mW), and high data rate transmissions (2.5 Gbps).

Properties of Multimode Optical Epoxy Polymer Waveguides Deposited on Silicon and TOPAS Substrate

“…Multimode polymer waveguides are a particularly attractive option for the ESR and USR communications because they exhibit favorable optical, mechanical and thermal properties allowing their direct integration onto low cost printed circuit boards with standard methods of conventional electronics manufacturing. Optical interconnects via polymer waveguides have attracted considerable attention during the last decade also because they enable fabrication of multimode optical waveguide structures on printed circuit boards [4][5][6][7][8] and flexible foil substrate using low-cost assembly and packaging methods [9], [10]. This paper presents a new approach to realize multimode polymer ridge waveguides for optical interconnection applications.…”