Physical limits for scaling of integrated circuits

Nawrocki, Waldemar

doi:10.1088/1742-6596/248/1/012059

Cited by 8 publications

(6 citation statements)

References 5 publications

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“…To enable this, packaging substrate is essential to fan out the compact circuitries between the 3D IC module and the main board, so that thermal expansion mismatch can be minimized, and a less dense main board is required (lower cost) (Lau, 2015). Moreover, scaling of silicon devices is reaching its physical limit (Nawrocki, 2010). Interconnect technology is also growing at a rapid pace (Figure 3).…”

Section: The Flexible Electronics Industrymentioning

confidence: 99%

Application of fuzzy integrated FMEA with product lifetime consideration for new product development in flexible electronics industry

Pun¹,

Rotanson

Cheung

et al. 2019

JIEM

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Purpose: the aim of this paper is to minimize the risks of new product development and shorten time-to-market, particularly for high-tech enterprise where the complexity of the product generate vast amount of failure mode.Design/methodology/approach: first, the concept of Critical Consideration Factor (CCF) is introduced based on product-specific technical characteristics, expected lifetime, and yield requirement to identify and prioritize the critical failure mode in the subsequent Failure Mode and Effect Analysis (FMEA), followed by process characterization on the high risk failure mode and Critical Parameter Management (CPM) practice to realize a robust mass production system of the developed technology. The application on the development of advanced flexible substrate and surface finishes fabrication technique is presented.Findings: through the proposed methodology, the risk level of each potential failure mode can be accurately quantified to identify the critical variables. With process characterization, reliability of the product is ensured. Consequently, significant reduction in development resources and time-to-market can be achieved.Practical implications: the development strategy allows high tech enterprises to achieve a balanced ecosystem in which value created through adaption of new technology/product can be thoroughly captured through commercialization in a timely manner with no field failure.Originality/value: the proposed development strategy utilizes a unique approach with thorough considerations that enables high tech enterprise to deliver new product with rapid time-to-market without sacrificing product lifetime reliability, which is key to achieve competitive advantage in the highly dynamic market.

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Section: The Flexible Electronics Industrymentioning

confidence: 99%

Application of fuzzy integrated FMEA with product lifetime consideration for new product development in flexible electronics industry

Pun¹,

Rotanson

Cheung

et al. 2019

JIEM

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“…1 Current conventional evaporation and deposition methods involving inorganic silicon-based electronics do not allow progression beyond the microscale owing to the natural physical limitations. 2 In this context, biomolecules such as nucleic acids and proteins are of interest due to their unique functional and complementary properties such as molecular recognition, self-assembly and folding, and the ability to mediate electric charges. 3,4 These nanoscale polymers offer high potential for structural manipulation that could be utilized in nanoconstructions for various applications.…”

Section: ■ Introductionmentioning

confidence: 99%

“…With the world advancing toward miniaturization, the exciting prospect of fabrication of nanodevices may only be practically possible through molecular electronics . Current conventional evaporation and deposition methods involving inorganic silicon-based electronics do not allow progression beyond the microscale owing to the natural physical limitations . In this context, biomolecules such as nucleic acids and proteins are of interest due to their unique functional and complementary properties such as molecular recognition, self-assembly and folding, and the ability to mediate electric charges. , These nanoscale polymers offer high potential for structural manipulation that could be utilized in nanoconstructions for various applications. , The key advantage of the molecular approach is the ability to design and fabricate devices using a cost-effective and environmentally friendly “bottom-up” approach …”

Section: Introductionmentioning

confidence: 99%

Printed-Circuit-Board-Based Two-Electrode System for Electronic Characterization of Proteins

et al. 2020

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Proteins have been increasingly suggested as suitable candidates for the fabrication of biological computers and other biomolecular-based electronic devices mainly due to their interesting structure-related intrinsic electrical properties. These natural biopolymers are environmentally friendly substitutes for conventional inorganic materials and find numerous applications in bioelectronics. Effective manipulation of protein biomolecules allows for accurate fabrication of nanoscaled device dimensions for miniaturized electronics. The prerequisite, however, demands an interrogation of its various electronic properties prior to understanding the complex charge transfer mechanisms in protein molecules, the knowledge of which will be crucial toward development of such nanodevices. One significantly preferred method in recent times involves the utilization of solid-state sensors where interactions of proteins could be investigated upon contact with metals such as gold. Therefore, in this work, proteins (hemoglobin and collagen) were integrated within a two-electrode system, and the resulting electronic profiles were investigated. Interestingly, structure-related electronic profiles representing semiconductivelike behaviors were observed. These characteristic electronic profiles arise from the metal (Au)−semiconductor (protein) junction, clearly demonstrating the formation of a Schottky junction. Further interpretation of the electronic behavior of proteins was done by the calculation of selected solid-state parameters. For example, the turn-on voltage of hemoglobin was measured to occur at a lower turn-on voltage, indicating the possible influence of the hem group present as a cofactor in each subunit of this tetrameric protein.

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“…With each size decrease, new scaling issues occurred primarily because of deposition technology limitations of that era. However, as we move closer to single nanometer nodes, fundamental limitations that originate from material properties start to take over as the main challenges that were previously reserved for instrumentation [2,3].…”

Section: Introductionmentioning

confidence: 99%

Epitaxial Growth of Thin Films

Rasic¹,

Narayan²

2019

Crystal Growth

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Epitaxial thin film heterostructures are critical for integrating multi-functionality on a chip and creating smart structures for next-generation solid-state devices. Here, we discuss the traditional lattice matching epitaxy (LME) for small lattice misfit and domain matching epitaxy (DME), which handles epitaxial growth across the misfit scale, where lattice misfit strain is predominant and can be relaxed completely, meaning that only the thermal and defect strains remain upon cooling. In low misfit systems, all three sources contribute to the residual strain upon cooling, as result of incomplete lattice relaxation. In the second part of the chapter, we will discuss the two critical contributors to the stress of the epitaxial film: the thermal coefficient of expansion mismatch and the lattice plane misfit. In the last part of the chapter, we will focus on unique cases where room temperature epitaxial growth is possible in nitride and oxide thin films.

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Physical limits for scaling of integrated circuits

Cited by 8 publications

References 5 publications

Application of fuzzy integrated FMEA with product lifetime consideration for new product development in flexible electronics industry

Application of fuzzy integrated FMEA with product lifetime consideration for new product development in flexible electronics industry

Printed-Circuit-Board-Based Two-Electrode System for Electronic Characterization of Proteins

Epitaxial Growth of Thin Films

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