Photonic crystal membrane reflectors by magnetic field-guided metal-assisted chemical etching

Balasundaram, Karthik; Mohseni, Parsian K.; Shuai, Yichen; Zhao, Ding; Zhou, Weidong; Li, Xiuling

doi:10.1063/1.4831657

Cited by 37 publications

(42 citation statements)

References 22 publications

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“…a superparamagnetic material for magnetic field-guided metal-assisted chemical etching. 39 FNWs may also be loaded with a nanoparticle cargo (c). With the membrane removed, these complex and high-surface-area structures may be utilized as inexpensive complex rear contacts 9 (d) for improved efficiency in thin-film optoelectronics; the large area and inexpensive processing may ease integration with roll-to-roll and other solutionbased processing techniques.…”

Section: Discussionmentioning

confidence: 99%

Nanowire formation is preceded by nanotube growth in templated electrodeposition of cobalt hybrid nanostructures

2016

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Cobalt fluted nanowires, novel nanostructures with a diameter of 200 nm consisting of a solid nanowire base and a thin, nanotubular flute shape, were grown in track-etched polycarbonate membranes via templated electrodeposition. The structures were characterized electrochemically via cyclic voltammetry, chronoamperometry, and charge stripping, and structurally via SEM, TEM, and focused ion beam cross-sectioning. Electrochemical and structural analysis reveals details of their deposition kinetics, structure, and morphology, and indicate possible mechanisms for their formation and control. These unique structures provide inspiration for an array of possible applications in electronics, photonics, and other fields.

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Section: Discussionmentioning

confidence: 99%

Nanowire formation is preceded by nanotube growth in templated electrodeposition of cobalt hybrid nanostructures

2016

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“…The sidewall verticality is affected by competing etching processes when mass transport of the oxidized species is limited. Details of the MacEtch mechanism, characteristics, and applications can be found elsewhere . In this work, all samples were initially cleaned with a diluted HCl solution to remove the native oxide in order to ensure an intimate contact between the deposited Au film and the underlying GaAs, critical to the uniformity and effectiveness of the MacEtch process.…”

Section: Methodsmentioning

confidence: 99%

Enhanced Optical Transmission through MacEtch‐Fabricated Buried Metal Gratings

et al. 2015

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Metallic films with subwavelength apertures, integrated into a semiconductor by metal-assisted chemical etch (MacEtch), demonstrate enhanced transmission when compared to bare semiconductor surfaces. The resulting "buried" metallic structures are characterized spectroscopically and modeled using rigorous coupled wave analysis. These composite materials offer potential integration with optoelectronic devices, for simultaneous near-uniform electrical contact and strong optical coupling to free space.

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“…On the one hand, thin-fi lm based MACE still relies on 2D templating techniques to pattern the catalyst-such as photolithography, [ 33 ] e-beam lithography, [ 22 ] interference lithography, [ 35 ] thin-fi lm dewetting, [ 25 ] nanosphere lithography, [ 36 ] and block-copolymer lithography. While there has been reported success in the control the catalyst etch direction to achieve 3D features via magnetic-assisted MACE [ 38,39 ] and engineering the catalyst motion, [ 22,[40][41][42] these approaches have limited control over the span of 3D features it can produce and have not been demonstrated to have high repeatability. This characteristic adds to the processing complexity, generates waste, and makes MACE's cost and scalability a function of other processes.…”

Section: Introductionmentioning

confidence: 99%

“…Furthermore, the lithographic patterning must be compatible with PS, which may lead to the aforementioned challenges. While there has been reported success in the control the catalyst etch direction to achieve 3D features via magnetic-assisted MACE [ 38,39 ] and engineering the catalyst motion, [ 22,[40][41][42] these approaches have limited control over the span of 3D features it can produce and have not been demonstrated to have high repeatability.…”

Section: Introductionmentioning

confidence: 99%

Direct Imprinting of Porous Silicon via Metal‐Assisted Chemical Etching

Azeredo

Lin

Avagyan

et al. 2016

Adv Funct Materials

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2929wileyonlinelibrary.com drug delivery, [ 8,9 ] and biosensing [ 10,11 ] are derived from such integration. However, micro-and nanopatterning of PS has remained a challenge due to the inability of standard microfabrication processes (e.g., photolithography, wet and dry etching) to effectively pattern PS. [ 12 ] In this paper, we demonstrate a low-cost, low-stress, ambient and high-throughput chemical nanoimprint approach to patterning smooth 3D curvilinear PS surfaces in a single imprinting operation. As a demonstration of this process, sinusoidal and parabolic surfaces with potential uses as diffraction gratings and concentrators are fabricated to demonstrate potential onchip micro-optical components.Traditional approaches to patterning Si do not extend to PS because of the permeability and reactivity of the latter. During photolithography and micromachining, photoresist, developers, and etchants infi ltrate the pores, leading to contamination of the substrate, poor sidewall control and over-etching and, in general, poor fi delity of pattern transfer. [ 12,13 ] A simple route to bypass these issues is to perform lithography prior to anodization. The patterned photoresist fi lm is used as a mask during the anodization step leading to 2D embedded PS patterns with micron-scale resolution. [ 14 ] Cost-effective wet-etching processes such as KOH cannot selectively etch PS since multi ple crystal facets are exposed. Recipes for dry etching methods must be specifi cally tailored to a particular pore morphology of the PS being etched and high-aspect ratio features are seldom reported. [ 12 ] To circumvent these issues, micro-contact printing (MP), [ 15 ] dry-removal soft-lithography (DWSL), [ 16 ] and direct imprinting of PS (DIPS) [ 17,18 ] methods have been developed to pattern PS. The MP method uses a stamp that blocks diffusion of reactants during anodization of the silicon surface. As a result, it offers few degrees of freedom for 3D patterning and, thus, is limited to fabricating shallow corrugated patterns. The latter two patterning methods exploit the controlled fracturing or collapsing of the brittle porous material to selectively strip or compress PS. While DWSL is restricted to 2D patterning with microscale resolution, DIPS can generate 3D features with sub-100 nm resolution. DIPS relies on the compaction of PS leading to permanent deformation of the substrate and, thus, modifying spatially the porous morphology and the optical Conventional lithographical techniques used for bulk semiconductors produce dramatically poor results when used for micro and mesoporous materials such as porous silicon (PS). In this work, for the fi rst time, a high-throughput, single-step, direct imprinting process for PS not involving plastic deformation or high-temperature processing is reported. Based on the underlying mechanism of metal-assisted chemical etching (MACE), this process uses a pre-patterned polymer stamp coated with a noble metal catalyst to etch PS immersed in an HF-oxidizer mixture. The process not only overcome...

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Photonic crystal membrane reflectors by magnetic field-guided metal-assisted chemical etching

Cited by 37 publications

References 22 publications

Nanowire formation is preceded by nanotube growth in templated electrodeposition of cobalt hybrid nanostructures

Nanowire formation is preceded by nanotube growth in templated electrodeposition of cobalt hybrid nanostructures

Enhanced Optical Transmission through MacEtch‐Fabricated Buried Metal Gratings

Direct Imprinting of Porous Silicon via Metal‐Assisted Chemical Etching

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