Phenomenological and microstructural analysis of room temperature creep in titanium alloys

Neeraj, T.; Hou, D.-H.; Daehn, Glenn S.; Mills, M.J.

doi:10.1016/s1359-6454(99)00426-7

Cited by 234 publications

(135 citation statements)

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“…Thompson et al [1] evaluated apparent activation energy (Q) of 37 kJ/mol as dislocations overcame interstitial atoms. Neeraj et al [5] and Hasija et al [6] claimed that this creep was Andrade creep. However, the extra low Q value reported by ref.…”

Section: Introductionmentioning

confidence: 98%

“…It has been revealed that several Ti alloys show significant creep behaviour at ambient temperature [1][2][3][4][5][6]. These works reported two types of deformation mechanisms: a planner slip in α-grains [1][2][3]5]; time-dependent deformation twins [4].…”

Section: Introductionmentioning

confidence: 99%

“…These works reported two types of deformation mechanisms: a planner slip in α-grains [1][2][3]5]; time-dependent deformation twins [4]. Thompson et al [1] evaluated apparent activation energy (Q) of 37 kJ/mol as dislocations overcame interstitial atoms.…”

Section: Introductionmentioning

confidence: 99%

“…the ambient-temperature creep region [8], into the Ashby-type deformation mechanism map of annealed CP-Ti [9], where the Q value was 10 kJ/mol. According to these previous works [1][2][3][4][5][6][7][8], the deformation and the rate-controlling mechanism of ambient- Creep tests were conducted in tension at temperatures from 203 K to 873 K with loads of 0.5-0.9σ 0.2 . The loading direction is parallel to the rolling direction in the both tests.…”

Section: Introductionmentioning

confidence: 99%

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New creep region and mechanism in hexagonal close-packed metals

Matsunaga

Kameyama

Ueda

et al. 2010

J. Phys.: Conf. Ser.

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Abstract. Only hexagonal close-packed (h.c.p.) materials show creep behaviour significantly at ambient temperature or less even below their 0.2% proof stresses with their stress exponents of 3.0 and their apparent activation energies of 20 kJ/mol. Transmission electron microscopy revealed dislocation arrays as a planar slip without any tangled dislocations inside each grain. Atomic force microscopy and electron backscatter diffraction pattern analyses brought about the occurrence of grain boundary sliding. The grain-size exponent was evaluated as 1.0, which means grain boundaries work as the barrier of the dislocation motion. Ambient-temperature creep of h.c.p. materials is schematically illustrated as that lattice dislocations move inside each grain without any obstacles and then pile up at grain boundaries. To continue the creep deformation, these dislocations are absorbed by grain boundaries to accommodate the internal stress and lead to grain boundary sliding.

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Section: Introductionmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

New creep region and mechanism in hexagonal close-packed metals

Matsunaga

Kameyama

Ueda

et al. 2010

J. Phys.: Conf. Ser.

View full text Add to dashboard Cite

show abstract

“…Several Ti alloys were investigated in the 1960s and 70s such as Ti-5Al-2.5Sn (Kiefer & Schwartzberg, 1967;Thompson & Odegard, 1973) and Ti-6Al-4V (Reiman, 1971;Odegard & Thompson, 1974;Imam & Gilmore, 1979). Later, Mills' group intensively studied this phenomenon using Ti-6Al and Ti-6Al-2Sn-4Zr-2Mo (Suri et al, 1999;Neeraj et al, 2000;Deka et al, 2006). Among these experimental studies restricted to Ti alloys, the present authors found recently that all hexagonal close-packed metals and alloys show creep behavior at ambient temperature below their 0.2% proof stresses, but no cubic metals or alloys show it under the same condition .…”

Section: Introductionmentioning

confidence: 99%