Phase separation morphology and mode II interlaminar fracture toughness of bismaleimide laminates toughened by thermoplastics with triphenylphosphine oxide group

Sun, Shujun; Guo, Miaocai; Yi, Xiaosu; Zhang, Zuoguang

doi:10.1007/s11431-016-0719-4

Cited by 8 publications

(5 citation statements)

References 32 publications

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“…Nanoparticles facilely agglomerate and disperse with difficulty into the resin system; the result of nanoparticles’ agglomeration is a deterioration of mechanical properties, without a toughing effect [ 17 , 18 ]. In addition, as the second phase, introducing rubber [ 19 , 20 ] thermoplastic polymer [ 21 , 22 , 23 ] into a BMI resin system is an effective toughening method; however, it results in a higher viscosity resin system. Wang et al [ 24 ] fabricated a novel BMI resin system using BMPP/BTM/DABPA with vinyl-terminated butadiene acrylonitrile (VTBN).…”

Section: Introductionmentioning

confidence: 99%

Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures

et al. 2023

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Bismaleimide (BMI) resin is an excellent performance resin, mainly due to its resistance to the effect of heat and its insulating properties. However, its lack of toughness as a cured product hampers its application in printed circuit boards (PCBs). Herein, a branched structure via Michael addition was introduced to a BMI system to reinforce its toughness. Compared with a pure BMI sample, the flexural strength of the modified BMI was enhanced, and its maximum value of 189 MPa increased by 216%. The flexural modulus of the cured sample reached 5.2 GPa. Using a scanning electron microscope, the fracture surfaces of BMI samples and a transition from brittle fracture to ductile fracture were observed. Furthermore, both the dielectric constant and the dielectric loss of the cured resin decreased. The breakdown field strength was raised to 37.8 kV/mm and the volume resistivity was improved to varying degrees. Consequently, the resulting modified BMI resin has the potential for wide application in high-frequency and low-dielectric resin substrates, and the modified BMI resin with a structure including three different diamines can meet the needs of various applications.

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Section: Introductionmentioning

confidence: 99%

Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures

et al. 2023

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“…During the past few decades, numerous approaches have been attempted to toughen BMI resin, including copolymerizing with allyl compounds, [ 8–10 ] rubber toughening, [ 11,12 ] thermoplastic resin modification, [ 13–15 ] nano‐filler modification, [ 3,16 ] and so on. Among these, copolymerizing with diallyl bisphenol‐A (DBA) is the most reliable toughening method due to the excellent heat resistant, processing characteristic and low dielectric property of the modified BMI resin.…”

Section: Introductionmentioning

confidence: 99%

“…linking density and rigid molecular network of cured resins, BMI resin exhibits low elongation at break, low fracture toughness, and low impact strength, which have negative effects on the performance of its terminal silica fiber reinforced composites (SF/BMI). [7] During the past few decades, numerous approaches have been attempted to toughen BMI resin, including copolymerizing with allyl compounds, [8][9][10] rubber toughening, [11,12] thermoplastic resin modification, [13][14][15] nano-filler modification, [3,16] and so on. Among these, copolymerizing with diallyl bisphenol-A (DBA) is the most reliable toughening method due to the excellent heat resistant, processing characteristic and low dielectric property of the modified BMI resin.…”

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confidence: 99%

Enhanced toughness and lowered dielectric loss of reactive POSS modified bismaleimide resin as well as the silica fiber reinforced composites

et al. 2021

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Inherent brittleness is the most weakness of bismaleimide resin, which adversely affects the performance and application of the terminal fiber reinforced bismaleimide composites. In this study, polyhedral oligomeric silsesquioxane (POSS) with glycidyl group (G-POSS) and methacryloxy propyl group (MA-POSS) are utilized to toughen diallyl bisphenol-A/N, N 0 -4,4 0 -diphenylmethane bismaleimide (BD resin) to obtain hybrid resins named BDGP and BDMP. The results of hybrid resins show that the two series hybrid resins perform higher toughness, strength, water resistance as well as lower dielectric constant and loss comparing with pristine BD resin, and BDMP perform better than BDGP due to that MA-POSS can react with BD resin while G-POSS cannot. In specific, the BDMP 3 in which 3 wt% MA-POSS is added performs the highest impact strength of 19.0 KJ/m 2 , increased by 102.1% comparing with pristine BD resin, and it also performs the lowest dielectric constant of 3.04 as well as lowest dielectric loss of 0.006 at 1 MHz. In addition, the silica fiber reinforced BDMP composites (SF/BDMP) are fabricated, and the results show that the bending strength and interlaminar shear strength of SF/BDMP 3 composite are enhanced to 290.2 and 32.5 MPa, 32.0% and 38.4% higher than those of SF/BD composite, and the corresponding dielectric loss (0.025) at 8.2 GHz is reduced by 45.9%. This research displays that reactive POSS can improve the toughness and reduce the dielectric loss of resin, which is benefit to obtain a high performance and functional resin-based composites with excellent mechanical properties and low dielectric properties.bismaleimide, low dielectric loss, polyhedral oligomeric silsesquioxane, SF/bismaleimide composites, toughness | INTRODUCTIONBismaleimide resin (BMI) is a commercial thermosetting resin with excellent strength, water resistance, thermal stability, and electrical insulation properties, [1][2][3] and it can be reinforced by silica fiber (SF) to fabricate wavetransparent composites with low dielectric constant and loss to meet the application in aviation, aerospace, highperformance electronic devices, printed circuit boards and other key areas. [4][5][6] However, due to the high cross-

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“…The previous studies provided solid evidence that the interlayer phase morphology was the coupled results of curing reaction, the diffusion process of TS resin and the PIPS in TP/TS blends system. Up to date, merely experimental studies were used to study the influences of different factors separately, such as the polarity of TP resin , curing cycle , the total number of TP films , and existing forms of TP resin , on the formation of interlayer microstructure, and the numerical analysis was rare. In fact, the simulation has the advantages of enabling the investigation of every factor involved, and it is an effective way to control the phase morphology and the composites mechanical property.…”

Section: Introductionmentioning

confidence: 99%

Investigation on interlayer phase morphology evolution of “Ex‐Situ” toughened composite laminate

et al. 2019

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The numerical simulation on the interlayer phase morphology evolution of "Ex-Situ" toughened laminate was performed in this study. Specifically, the diffusion process of thermoset (TS) resin into thermoplastic (TP) resin was modeled incorporating the negative effect of resin curing reactions. The dynamic process of polymerization-induced phase separation in TP/TS blends was predicted by the modified Cahn-Hilliard equation, in which the concentration-dependent mobility was used to describe dynamic asymmetry between TP resin and TS resin, and the mixing free energy of the blends contained the contribution of resin curing reactions. The phase morphology evolution of polysulfone/epoxy blends in the interlaminar region was analyzed numerically, and the results indicated that the diffusion process resulted in the concentration-gradient distribution of epoxy resin in interlayer, and when the concentration-gradient decreased, the interlayer phase morphology developed from the coexistence of different microstructures to the presence of a single structural form. The post-curing temperature played a more important role in the phase separation than that in resin curing reaction, and the separated structures were only observed in the local region of interlayer under low post-curing temperature, due to small driving force of phase separation. Moreover, the movements of epoxy molecules dominated the microstructure formation process. POLYM. COMPOS., 40:3644-3656, 2019.

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Phase separation morphology and mode II interlaminar fracture toughness of bismaleimide laminates toughened by thermoplastics with triphenylphosphine oxide group

Cited by 8 publications

References 32 publications

Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures

Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures

Enhanced toughness and lowered dielectric loss of reactive POSS modified bismaleimide resin as well as the silica fiber reinforced composites

Investigation on interlayer phase morphology evolution of “Ex‐Situ” toughened composite laminate

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