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Abstract:The effect of plant-fiber paper or silver nanowires-loaded paper interleaves on the electrical conductivity and interlaminar fracture toughness of composites was studied. Highly conductive paper was prepared by surface-loaded silver nanowires. The percolation threshold appeared at about 0.4 g/m 2 . The surface resistivity reached 2.3 Ω/sq when the areal density of silver nanowires was 0.95 g/m 2 . After interleaving the conductive papers in the composite interlayers, in-plane electrical conductivity perpendicular to the fiber direction was increased by 171 times and conductivity through thickness direction was increased by 2.81 times. However, Mode I and Mode II interlaminar fracture toughness decreased by 67.3% and 66.9%, respectively. Microscopic analysis showed that the improvement of conductivity was attributable to the formation of an electrical conducting network of silver nanowires which played a role in electrical connection of carbon fiber plies and the interleaving layers. However, the density of the highly packed flat plant fibers impeded the infiltration of resin. The parallel distribution of flat fibers to the carbon plies, and poor resin-fiber interface made the interlaminar fracture occur mainly at the interface of plant fibers and resin inside the interleaves, resulting in a decline of the interlaminar fracture toughness. The surface-loading of silver nanowires further impeded the infiltration of resin in the densely packed plant fibers, resulting in further decline of the fracture toughness.

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This study investigated the effect of the fusion-bonded dots of veil interleaves on the crack propagation path of the interlaminar fracture of continuous carbon fiber reinforced epoxy resin. Two thin fiber layers (i.e., nylon veil (NV) with fusion-bonded dots and Kevlar veil (KV) physically stacked by fibers) were used to toughen composites as interleaves. Result shows that the existence of fusion-bonded dots strongly influenced the crack propagation and changed the interlaminar fracture mechanism. The Mode I fracture path of the nylon veil interleaved composite (NVIC) could propagate in the plane where the dots were located, whereas the path of the Kevlar veil interleaved composite (KVIC) randomly deflected inside the interlayer without the pre-cracking of the dots. The improvement of Mode I toughness was mainly based on fiber bridging and the resulting fiber breakage and pull-out. Fiber breakage was often observed for NVIC, whereas fiber pull-out was the main mechanism for KVIC. For the Mode II fracture path, the fusion-bonded NV dots guided the fracture path largely deflected inside the interlayer, causing the breakage of tough nylon fibers. The fracture path of the physically stacked KVIC occurred at one carbon ply/interlayer interface and only slightly deflected at fiber overlapped regions. Moreover, the fiber pull-out was often observed.