Due to its lead-free composition and a unique double polarization hysteresis loop with a large maximum polarization (P max ) and a small remnant polarization (P r ), AgNbO 3 -based antiferroelectrics (AFEs) have attracted extensive research interest for electric energy storage applications. However, a low dielectric breakdown field (E b ) limits an energy density and its further development. In this work, a highly efficient method was proposed to fabricate high-energy-density Ag(Nb,Ta)O 3 capacitor films on Si substrates, using a two-step process combining radio frequency (RF)-magnetron sputtering at 450 ℃ and post-deposition rapid thermal annealing (RTA). The RTA process at 700 ℃ led to sufficient crystallization of nanograins in the film, hindering their lateral growth by employing short annealing time of 5 min. The obtained Ag(Nb,Ta)O 3 films showed an average grain size (D) of ~14 nm (obtained by Debye-Scherrer formula) and a slender room temperature (RT) polarization-electric field (P-E) loop (P r ≈ 3.8 C•cm −2 and P max ≈ 38 C•cm −2 under an electric field of ~3.3 MV•cm −1 ), the P-E loop corresponding to a high recoverable energy density (W rec ) of ~46.4 J•cm −3 and an energy efficiency (η) of ~80.3%. Additionally, by analyzing temperature-dependent dielectric property of the film, a significant downshift of the diffused phase transition temperature (T M2-M3 ) was revealed, which indicated the existence of a stable relaxor-like † Hongbo Cheng and Xiao Zhai contributed equally to this work.