2018 IEEE International Memory Workshop (IMW) 2018
DOI: 10.1109/imw.2018.8388845
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Phase-Change Memory: Performance, Roles and Challenges

Abstract: In this paper we analyze recent progress in Phase-Change Memory (PCM) technology targeting both Storage Class Memory and embedded applications. The challenge to achieve a high temperature data retention without compromising the device programming speed can be addressed by material engineering. We show that volume and thermal confinement improvement of the phase-change material enables a high (10-fold) reduction of the programming current, achieved also by the optimization of the device architecture, in particu… Show more

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Cited by 16 publications
(10 citation statements)
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“…The device characteristics can be tuned through material engineering (doping, etc.). Thus, they have the capability to address the high temperature retention required in embedded applications and the high speed required, for example, in storage class memory applications depending on the elected stack [72,73].…”
Section: Phase Change Memorymentioning
confidence: 99%
“…The device characteristics can be tuned through material engineering (doping, etc.). Thus, they have the capability to address the high temperature retention required in embedded applications and the high speed required, for example, in storage class memory applications depending on the elected stack [72,73].…”
Section: Phase Change Memorymentioning
confidence: 99%
“…These timing parameters are based on a 266MHz memory clock and a DDR2 interface [37] (see also Table 5 for our simulation parameters). Figure 2 illustrates a PCM bank's peripheral structures in detail [17,19,37,41,59,60]. There are 128 peripheral structures, which are shared across all bitlines in the bank.…”
Section: Background On Pcmmentioning
confidence: 99%
“…Figure 2 illustrates a PCM bank's peripheral structures in detail [17,19,37,41,59,60]. There are 128 peripheral structures, which are shared across all bitlines in the bank.…”
Section: Enabling Partition-level Parallelism In Pcmmentioning
confidence: 99%
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“…Material and stoichiometry engineering in PCM is considered the main factor for boosting the device performances [6]. Materials along the GeTe-Sb2Te3 tie line, such as GeTe [7] or GeSb2Te4 [8], were identified for their high programming speed and they represent possible candidates for SCM applications.…”
Section: Introductionmentioning
confidence: 99%