2010 International Electron Devices Meeting 2010
DOI: 10.1109/iedm.2010.5703442
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Phase change memory line concept for embedded memory applications

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Cited by 11 publications
(8 citation statements)
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“…Even though AIST has been used for prototype PCRAM device fabrication in academic studies [13] it is unlikely that it will be found in PCRAM products because of the incompatibility of Ag and In containing alloys with CMOS technology. However, using another dopant, successful array level integration in an advanced 65 nm CMOS process flow of a PCRAM memory concept based on a narrow line of a doped-Sb 2 Te phase has been demonstrated [14,15].…”
Section: Principle Of Phase Change Technologymentioning
confidence: 98%
“…Even though AIST has been used for prototype PCRAM device fabrication in academic studies [13] it is unlikely that it will be found in PCRAM products because of the incompatibility of Ag and In containing alloys with CMOS technology. However, using another dopant, successful array level integration in an advanced 65 nm CMOS process flow of a PCRAM memory concept based on a narrow line of a doped-Sb 2 Te phase has been demonstrated [14,15].…”
Section: Principle Of Phase Change Technologymentioning
confidence: 98%
“…1. At the opposite side, in a self-heating cell the phase change is due only to the Joule heating produced by the current flux within the chalcogenide layer [17], [18], [19]. The amorphouscrystalline transition begins in a hot spot within the chalcogenide layer, where the local nanostructure accommodates thermodynamic conditions favorable to nucleation, as a consequence of the energy dissipation provided by electric transport; then, the nuclei grow and form a filament that eventually connects the two contacts.…”
Section: Sources Of Variabilitymentioning
confidence: 99%
“…Depending on the nature and working of these devices current may flow continuously or for short intervals through the contacts in a device. In a Phase Change Random Access Memory (PCRAM) cell, the functional layer is a thinfilm of chalcogenide alloy or Phase Change Material (PCM) integrated into the first metalization level of the integrated circuit [1]. The contacts for this memory cell are established between the PCM layer and the interconnect metalization.…”
Section: Introductionmentioning
confidence: 99%