Abstract:In order to investigate the performance potential of 3-&mensionally integrated circuits for high performance computer systems a comparative study of the interconnect structure of a RISC-processor/cache system has been conducted. The impact of electrical parameters of interconnection lines as well as associated package parasitics on second level cache read access is investigated for 3-dimensionally integrated circuit structures and compared to conventional PCB-and advanced MCM-realizations of the system. Wiring… Show more
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