2005
DOI: 10.1016/j.mee.2005.04.069
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Performance and new effects in advanced SOI devices and materials

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Cited by 6 publications
(4 citation statements)
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“…The trapezoidal trigate MOSFET consists of two inclined lateral gates and a flat gate on the top of the gate oxide and channel. One of the main pertinent improvement in the trapezoidal trigate device structure is the mitigation of corner leakage current due to gate overlapping in rectangular device [9]. The other factor of high‐speed operation at reduced power consumption can be achieved by silicon‐on‐insulator (SOI) technology where in the layer of buried oxide (BOx) such as silicon dioxide, air etc.…”
Section: Introductionmentioning
confidence: 99%
“…The trapezoidal trigate MOSFET consists of two inclined lateral gates and a flat gate on the top of the gate oxide and channel. One of the main pertinent improvement in the trapezoidal trigate device structure is the mitigation of corner leakage current due to gate overlapping in rectangular device [9]. The other factor of high‐speed operation at reduced power consumption can be achieved by silicon‐on‐insulator (SOI) technology where in the layer of buried oxide (BOx) such as silicon dioxide, air etc.…”
Section: Introductionmentioning
confidence: 99%
“…In order to extend CMOS scaling down to the performance limit, double-gate (DG) MOSFET is proposed as a promising non-classical structure to replace the traditional bulk CMOS devices. [1,2] Paralleling with the advance of fabrication technology and structure revolution, [3] device physics research [4] and compact model development of DG MOSFET also become intense subjects. The previous DG MOSFET compact models, however, were derived mainly from Poisson equation on the assumption that only the mobile charge was considered while the doping effect was neglected.…”
Section: Introductionmentioning
confidence: 99%
“…Several studies have been performed, principally with silicon-on-insulator (SOI) technology which is used for MOSFETs in high temperature fields. Also the inner structure of the SOI was modeled by means of thermal analysis in order to achieve devices which can withstand higher temperatures [3][4][5][6][7]. Although the heat generation occurs in SOIs, the heat transfer depends on the external structure, i.e.…”
Section: Introductionmentioning
confidence: 99%