Peeling of metal foil from a compliant substrate

Islam, Md. Shafiqul; Alfredsson, K.S.

doi:10.1080/00218464.2019.1696678

Cited by 6 publications

(3 citation statements)

References 42 publications

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“…For the trapezoidal TSL, shown in Figure 3, the damage variable

((), D)

is obtained using Equation (9). 24

D goodbreak= ({, \begin{matrix} 0 0 \leq δ \leq δ_{1} \\ 1 goodbreak- \frac{σ_{c}}{Kδ} δ_{1} \leq δ \leq δ_{2} \\ 1 goodbreak- \frac{σ_{c}}{Kδ} \frac{δ_{3} - δ}{δ_{3} - δ_{2}} δ_{2} \leq δ \leq δ_{3} \\ 1 δ \geq δ_{3} \end{matrix}) .

…”

Section: Equivalent Trapezoidal Traction–separation Lawmentioning

confidence: 99%

An equivalent cohesive zone model for a wide range of ductile and brittle adhesives

Noruzi,

Khoramishad

2023

Fatigue Fract Eng Mat Struct

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This paper aims to propose an equivalent trapezoidal traction–separation law (ET‐TSL) of the cohesive zone model applicable to a wide range of ductile and brittle adhesives using equivalent and fictitious material concepts. The ET‐TSL can reduce the analysis time and cost of complex problems without degrading the prediction accuracy. To experimentally validate the proposed ET‐TSL, double‐cantilever beam (DCB) samples were fabricated with glass fiber‐reinforced polymer substrates and a highly ductile adhesive and then tested. The fracture behavior of the specimens was modeled using the proposed ET‐TSL. Moreover, the accuracy and comprehensiveness of the proposed model were verified by employing the proposed ET‐TSL for different adhesive joints made of different adhesives ranging from brittle to ductile adhesives and different substrates found in the literature. It was found that the proposed ET‐TSL can provide reasonable accuracy in simulating the fracture response of different types of adhesive joints with brittle and ductile adhesives.

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“…For the trapezoidal TSL, shown in Figure 3, the damage variable

((), D)

is obtained using Equation (9). 24

D goodbreak= ({, \begin{matrix} 0 0 \leq δ \leq δ_{1} \\ 1 goodbreak- \frac{σ_{c}}{Kδ} δ_{1} \leq δ \leq δ_{2} \\ 1 goodbreak- \frac{σ_{c}}{Kδ} \frac{δ_{3} - δ}{δ_{3} - δ_{2}} δ_{2} \leq δ \leq δ_{3} \\ 1 δ \geq δ_{3} \end{matrix}) .

…”

Section: Equivalent Trapezoidal Traction–separation Lawmentioning

confidence: 99%

An equivalent cohesive zone model for a wide range of ductile and brittle adhesives

Noruzi,

Khoramishad

2023

Fatigue Fract Eng Mat Struct

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“…A semi-analytical expression for the work done by bending plasticity is proposed to provide a precise value of the interface fracture energy [7]. A trans-scale mechanics model has been adopted to describe the interfacial fracture behaviors of the metal thin film peeled on the ceramic substrate and optimization scheme for peel force and root rotation [8,9]. In the nonlinear delamination analysis for thin films using conventional elastic-plastic theory, results show that the peak separation stress levels during the delamination of the film can never exceed 4 times the yield stress [10,11].…”

Section: Introductionmentioning

confidence: 99%

Numerical simulation of peel test for ductile thin film along ceramic substrate: Elasto-plastic analysis

Adjeloua¹,

Boualem²,

Meddah³

et al. 2021

JMES

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Due to extensive applications of the thin film/substrate systems in engineering, the research on strength, ductility and reliability of these systems have attracted great deal of interest in recent years. The peel angle of debonded film on the ceramic substrate has a very important effect in the mechanical resistance of film/substrate bi-material. Among critical debonding parameters, peeling angle and thermal residual stresses can be a potential risk of brutal propagation causing the film/substrate composite failure under tensile loading. This study is carried out to analyze the peeling angle and residual thermal stresses effects with crack growth in the specimen. A two dimensional elastic-plastic finite element model is used to compute the J-integral and estimate the plastic zone size at the interfacial crack tip of film/substrate composite. Results show that the peeling phenomena is a fracture mixed mode where the dominance of either mode I or mode II is influenced by the peeling angle while delamination of thin film is greatly dependent on thermal residual stresses.

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“…An important step is to understand the mechanical and fracture properties of the packaging material. Packaging materials generally comprise various layers of paperboard, polymers and aluminum foil (Al-foil) [2]. Al-foil and the low-density polyethylene (LDPE) film are studied in this paper.…”

Section: Introductionmentioning

confidence: 99%

Fracture Toughness Analysis of Aluminum (Al) Foil and Its Adhesion with Low-Density Polyethylene (LPDE) in the Packing Industry

et al. 2021

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Liquid food packages consist of various polymers films, which are bonded together with Aluminum foil (Al-foil) using adhesion or by direct heat. The main aim of this research was to define important material properties such as fracture toughness and some FE-simulation material model parameters such as damage initiation, damage evolution, and the adhesion between Al-foil and low-density polyethylene (LDPE) film. This investigation is based on both physical experiments and FE simulations in ABAQUS with and without initial cracks of different lengths for comparison purposes. The final FE model in ABAQUS was used to compare the numerical input parameters in an extensive study with the ambition to investigate the materials’ parameters in cases with or without adhesion between laminates. Finally, the relation between the theoretical and experimental results for Al-foil using linear elastic fracture mechanics and modified strip yield model were shown, and the fracture toughness was calculated for two different thicknesses of Al-foil.

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Peeling of metal foil from a compliant substrate

Cited by 6 publications

References 42 publications

An equivalent cohesive zone model for a wide range of ductile and brittle adhesives

An equivalent cohesive zone model for a wide range of ductile and brittle adhesives

Numerical simulation of peel test for ductile thin film along ceramic substrate: Elasto-plastic analysis

Fracture Toughness Analysis of Aluminum (Al) Foil and Its Adhesion with Low-Density Polyethylene (LPDE) in the Packing Industry

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