PCB Embedding Technology for the Miniaturization of complex electronic systems

Löher, Thomas; Schutze, David; Spanier, Malte; Ostmann, A.; Schuster, Martin

doi:10.1109/icsj55786.2022.10034702

Cited by 3 publications

(3 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…As a result, the effectiveness of the shielding is decreased. This multireflection plays an important role particularly for low frequencies and thin shielding layer thicknesses (𝑡) (5).…”

Section: Multireflection 𝑀 (𝑑𝐵)mentioning

confidence: 99%

Unlocking the True Power of Additive Manufacturing for EMI Shielding

Scheibel,

Kaiser,

Balasubramaniam

et al. 2024

IMAPSource Proceedings

View full text Add to dashboard Cite

Miniaturization trends in electronic packaging led to reduced spacing of individual packages on the printed circuit boards and thus increased the overall electromagnetic interference (EMI) levels within a device. State-of-the-art conformal coatings as EMI shielding layers are typically applied via sputter technology and offer design limitations with respect to coating selectivity on individual positions of the overall package. Our new technology of additively Ag layer application via inkjet printing overcomes today’s design limitations and is key enabler for next generations packaging designs. In this study, we compare the shielding effectiveness (S.E.) on specifically designed transmission line emitter samples coated with state-of-the-art sputtered conformal layers against silver coatings applied via inkjet printing of particle free metal organic decomposition inks to evaluate the new technology for its potential on package level shielding performance. Mechanical and electrical characterization of the silver coatings indicate appropriate tools to specify layer characteristics and ensure S.E. of 40 dB or higher at frequencies of 800 MHz and higher. The suitability of our well-tailored silver coatings to match typical S.E. requirements is shown with even much thinner layer thickness as compared to state-of-the-art coatings.

show abstract

Section: Multireflection 𝑀 (𝑑𝐵)mentioning

confidence: 99%

Unlocking the True Power of Additive Manufacturing for EMI Shielding

Scheibel,

Kaiser,

Balasubramaniam

et al. 2024

IMAPSource Proceedings

View full text Add to dashboard Cite

show abstract

“…Schematic layer structure of a milled out and electronically fully functional package with embedded high temperature resistant ASICs and passive components (top). At substrate level, reembedded package from above in a solid copper frame in preparation for hermetic metal encapsulation (mid) and subsequent structuring of the outer layers by lithographic and wet-chemical processes (bottom) [15]. Fig.…”

Section: ) Pre-packagementioning

confidence: 99%

“…Schematic layer structure for integration of and electrical contact to the outside world by means of ceramic circuit carriers and sensors at substrate level (top). Finished basic packages at substrate level after the combined sintering-laminating process step (bottom) [15]. module positions) (Fig.…”

Section: ) Pre-packagementioning

confidence: 99%

Sensor Systems for Extremely Harsh Environments

Kappert¹,

Schopferer²,

Saeidi³

et al. 2022

Journal of Microelectronics and Electronic Packaging

View full text Add to dashboard Cite

Sensors are key elements for capturing environmental properties and are today indispensable in the industry for monitoring and control of industrial processes. Many applications are demanding for highly integrated intelligent sensors to meet the requirements on safety, clean, and energy-efficient operation, or to gain process information in the context of industry 4.0. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently, the use of sensor systems is impossible due to the fact that the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical loads do not allow a reliable operation of sensitive electronic components. Eight Fraunhofer Institutes have bundled their competencies and have run the Fraunhofer Lighthouse Project "eHarsh" to overcome this situation. The project goal was to realize sensor systems for extremely harsh environments, whereby sensor systems are more than pure sensors, rather these are containing one or multiple sensing elements and integrated readout electronics. Various technologies, which are necessary for the realization of such sensor systems, have been identified, developed, and finally bundled in a technology platform. These technologies are, e.g., MEMS and ceramic-based sensors, SOI-CMOS-based integrated electronics, board assembly and laser-based joining technologies. All these developments have been accompanied by comprehensive tests, material characterization, and reliability simulations. Based on the platform, a pressure sensor for turbine applications has been realized to prove the performance of the eHarsh technology platform.

show abstract