2022 IEEE CPMT Symposium Japan (ICSJ) 2022
DOI: 10.1109/icsj55786.2022.10034702
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PCB Embedding Technology for the Miniaturization of complex electronic systems

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Cited by 3 publications
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“…As a result, the effectiveness of the shielding is decreased. This multireflection plays an important role particularly for low frequencies and thin shielding layer thicknesses (𝑡) (5).…”
Section: Multireflection 𝑀 (𝑑𝐵)mentioning
confidence: 99%
“…As a result, the effectiveness of the shielding is decreased. This multireflection plays an important role particularly for low frequencies and thin shielding layer thicknesses (𝑡) (5).…”
Section: Multireflection 𝑀 (𝑑𝐵)mentioning
confidence: 99%
“…Schematic layer structure of a milled out and electronically fully functional package with embedded high temperature resistant ASICs and passive components (top). At substrate level, reembedded package from above in a solid copper frame in preparation for hermetic metal encapsulation (mid) and subsequent structuring of the outer layers by lithographic and wet-chemical processes (bottom) [15]. Fig.…”
Section: ) Pre-packagementioning
confidence: 99%
“…Schematic layer structure for integration of and electrical contact to the outside world by means of ceramic circuit carriers and sensors at substrate level (top). Finished basic packages at substrate level after the combined sintering-laminating process step (bottom) [15]. module positions) (Fig.…”
Section: ) Pre-packagementioning
confidence: 99%