2024
DOI: 10.4071/001c.94488
|View full text |Cite
|
Sign up to set email alerts
|

Unlocking the True Power of Additive Manufacturing for EMI Shielding

Markus G. Scheibel,
Michael P. Kaiser,
Sutharsan Balasubramaniam
et al.

Abstract: Miniaturization trends in electronic packaging led to reduced spacing of individual packages on the printed circuit boards and thus increased the overall electromagnetic interference (EMI) levels within a device. State-of-the-art conformal coatings as EMI shielding layers are typically applied via sputter technology and offer design limitations with respect to coating selectivity on individual positions of the overall package. Our new technology of additively Ag layer application via inkjet printing overcomes … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 8 publications
(11 reference statements)
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?