Pattern Transfer Printing (PTPTM) for c-Si Solar Cell Metallization

Lossen, J.; Matusovsky, M.; Noy, Aleksandr; Maier, C.; Bähr, M.

doi:10.1016/j.egypro.2015.03.299

Cited by 22 publications

(22 citation statements)

References 1 publication

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“…The first one is Thermal Induced Nozzle Laser Induced Forward Transfer (TIN-LIFT), which relies on accurate material deformation through laser pulse control to achieve the desired contact morphology [58,59]. The second one is Pattern Transfer Printing (PTP), which consists of a first step where a mold with the negative image of the desired pattern is filled with Ag paste, followed by the laser flash [60,61]. With the latter technique, very narrow (< 30 μm), high aspect ratio contacts have been achieved and proof-of-concepts cells with low Ag consumption and high fill factors (up to 79 %) have already been obtained.…”

Section: Alternative Metallizationsmentioning

confidence: 99%

Summary of the 5th Workshop on Metallization for Crystalline Silicon Solar Cells

Beaucarne¹,

Schubert

Hoornstra

2015

Energy Procedia

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The 5 th Metallization Workshop took place in Constance, Germany on 20 and 21 October 2014 and provided an overview of research and development in the field of solar cell metallization. Enhanced understanding of contact structure and formation was obtained thanks to new characterization techniques. Great progress in metallization technologies was also reported. Screen printing technology is continuing its trajectory of continuous improvement, notably with fine-line screen printing (linewidth < 50 μm) becoming a reality. Ni/Cu plating technology is also progressing fast, with many of the technical barriers to adoption being successfully removed. Finally, the workshop also highlighted the move towards a module-centric design of solar cell metallization, targeting high performance and low cost at module level.

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Section: Alternative Metallizationsmentioning

confidence: 99%

Summary of the 5th Workshop on Metallization for Crystalline Silicon Solar Cells

Beaucarne¹,

Schubert

Hoornstra

2015

Energy Procedia

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“…Screen-printing is a robust and cost-efficient production process, but the resulting finger width is limited by the mesh wire thickness and material used in conventional screen manufacturing [6,12]. New application technologies, such as knotless screen [12], dispensing [13], flexographic print [14], or Pattern Transfer Printing™ (PTP) [15], as well as suitable paste formulations are needed to excel the actual finger width and AR limits.…”

Section: Introductionmentioning

confidence: 99%

“…PTP is a contactless printing technology based on laser induced paste deposition from a polymer substrate, so-called tape. This method enables the manufacturing of ultra-fine finger lines (< 20 μm) with high aspect ratio (> 0.6) since the trench width and height in the typically used tapes are 20 μm [15,29].…”

Section: Introductionmentioning

confidence: 99%

Non-volatile free silver paste formulation for front-side metallization of silicon solar cells

Yüce

Okamoto²,

Karpowich³

et al. 2019

Solar Energy Materials and Solar Cells

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We present a versatile, cost-effective formulation platform for highly conductive silver pastes used in front-side metallization of silicon (Si) solar cells. Pastes based on the capillary suspension concept include silver particles, glass frit and two immiscible fluids. Capillary forces inferred from the second fluid added only in small fractions induce the formation of a percolating particle network. This provides extended shelf-life and distinct flow properties adjustable in a wide range as demanded by the respective printing process, thus yielding residual-free sintered electrodes. Si-wafers are successfully metallized with such pastes using conventional screen-printing, knotless screen and Pattern Transfer Printing™. Paste spreading is studied via high-speed imaging during screenprinting on glass plates. Morphology of printed lines is analyzed using laser scanning microscopy. Electrical properties of the cells are characterized employing a solar simulator and electroluminescence spectroscopy. Results are compared to those obtained using commercial pastes including the same silver particles and glass frits. Paste performance strongly depends on the selected secondary fluid. Aspect ratios ≈0.4-0.5 can be reached and cell efficiencies η eff ≈ 21% on Cz-and 18.6% on mc Si-wafers are obtained. Additional investigations are necessary to further reduce paste spreading and line interruptions thus improving cell performance.

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“…However this low curing temperature causes a higher resistivity of the paste compared to standard firing through ones. [2,3].…”

mentioning

confidence: 99%

“…We also present preliminary results of the application of SAM layers as a patterned resist to plate thin lines of nickel, nickel here being meant to become an adhesion layer prior to copper plating. 12,12,13,13,14,14,15,15,15,15-nonafluoropentadecylphosphonic acid (fC15-PA), 12,12,13,13,14,14,15,15,16,16,17,17-tridecafluoroseptadecylphosphonic acid (fC17-PA), 12,12,13,13,14,14,15,15,16,16,17,17,18,18,19,19,19-Heptadecafluorononadecylphosphonic acid(fC19-PA), and 10,11-Bis (2,2,3,3,4,4,5,5,6,6,7,7,8,8,…”

mentioning

confidence: 99%

Patterning solar cell metal grids on transparent conductive oxides using self-assembled phosphonic acid monolayers

et al. 2019

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We present a novel, simple and cost-effective method for patterning transparent conductive oxides (TCO) in order to form solar cell's metal grid by electro-plating. Self-assembled monolayers (SAMs) are prepared by dipping substrates in or spraying TCO with perfluorinated and alkylated phosphonic acid solutions. The investigated chemistry and explored deposition parameters on Indium Tin Oxide (ITO) have resulted in highly hydrophobic surfaces with exceptional coverage of the TCO by the SAMs. The resistance of the deposited layers to acidic plating conditions has been a challenge but layers at optimized processing conditions have demonstrated masking properties for nickel electroplating. Graphical abstract Highlights: Dense, self-assembled monolayers of phosphonic acids on indium tin oxide surfaces of silicon heterojunction solar cells are produced by a simple and cost-effective spraying method. Good chemical resistance to highly acidic copper electrolyte is provided by the selfassembled monolayer and low degradation of ITO is observed after 10 minute immersion in solutions of pH < 1. Thin nickel lines are obtained on a patterned self-assembled monolayer on ITO by electroplating with little ghost-plating.

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Pattern Transfer Printing (PTPTM) for c-Si Solar Cell Metallization

Cited by 22 publications

References 1 publication

Summary of the 5th Workshop on Metallization for Crystalline Silicon Solar Cells

Summary of the 5th Workshop on Metallization for Crystalline Silicon Solar Cells

Non-volatile free silver paste formulation for front-side metallization of silicon solar cells

Patterning solar cell metal grids on transparent conductive oxides using self-assembled phosphonic acid monolayers

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