Parametric study on bending and thickening in laser forming of a bowl shaped surface

Laser forming of a bowl shaped surface with a stationary laser beam

“…The CV of bending angle for 8 mm and 10 mm laser spot diameter was 0.04, much less than the minimum (0.07) reported by Chakraborty et al [8]. The variation of CV of bending angle did not show any clear trend with variation of irradiation time and laser spot diameter.…”

“…The scan lines closed to the periphery of the flat circular blank were recommended to be scanned first. This was further corroborated by the observation of Chakraborty et al [8] who investigated the effect of laser parameters and different circular and radial scan line sets on the average bending angle and its coefficient of variation (CV) in laser formed bowl shaped surfaces. Yang et al [9] gave a strategy in which mutually perpendicular scan line sets were used for laser forming of bowl shaped surfaces.…”

“…The bending angle and its CV reported for different laser parameter combinations are the mean of 3 values obtained for 3 replicates. This was done according to [8]. The experimental set-up is shown in Fig.…”

“…The motion of the laser beam also is an inherent asymmetric feature of the process. Several strategies have been proposed and explored by researchers for laser forming of bowl shaped surface [6][7][8][9][10]. Magee et al [6] suggested for using concentric circular scan paths with laser parameters suitable for UM to form a bowl shaped surface.…”

A study on co-axial water-jet assisted fiber laser grooving of silicon

“…They are being adopted in cutting of thick (Wandera et al, 2009) and thin sheets (Baumeister et al, 2006) of various materials, cladding (Valsecchi and Previtali, 2013), welding (Bandyopadhyay et al, 2014), forming (Chakraborty et al, 2012), paint removal (Madhukar et al, 2013a), water-jet assisted laser paint removal (Madhukar et al, 2013b), surface hardening , underwater laser cutting (Mullick et al, 2013), and micromachining of Ti6Al4 V for bio medical applications (Mukherjee et al, 2013) etc. Therefore, an attempt has been made to use an Yb-fiber laser operating at 1.07 m wavelength for control grooving of silicon.…”