Laser Forming of Mild Steel Sheets Using Different Surface Coatings

Gautam, Sachin S.; Singh, Sunil Kumar; Dixit, Uday S.

doi:10.1007/978-81-322-2352-8_2

Cited by 12 publications

(7 citation statements)

References 13 publications

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“…This difficulty is compounded by copper being highly reflective to all wavelengths above its absorption edge that occurs near 600 nm wavelengths (Figure a) . Conventional laser forming uses CO 2 lasers but metals are highly reflective to the 10.6 μm wavelength laser so a graphite coating is often used to improve absorbance of the laser. ,, Such a coating is unnecessary when laser forming metals with shorter wavelength lasers ,,,, as metals tend to be less reflective to shorter wavelengths . Consequently, visible (532 nm) and UV (355 nm) lasers are desirable when patterning copper as they do not need graphite coatings that can cause short circuits.…”

Section: Resultsmentioning

confidence: 99%

Self-Folding PCB Kirigami: Rapid Prototyping of 3D Electronics via Laser Cutting and Forming

Bachmann

Hanrahan

Dickey

et al. 2022

ACS Appl. Mater. Interfaces

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This paper demonstrates laser forming, localized heating with a laser to induce plastic deformation, can self-fold 2D printed circuit boards (PCBs) into 3D structures with electronic function. There are many methods for self-folding but few are compatible with electronic materials. We use a low-cost commercial laser writer to both cut and fold a commercial flexible PCB. Laser settings are tuned to select between cutting and folding with higher power resulting in cutting and lower power resulting in localized heating for folding into 3D shapes. Since the thin copper traces used in commercial PCBs are highly reflective and difficult to directly fold, two approaches are explored for enabling folding: plating with a nickel/gold coating or using a single, high-power laser exposure to oxidize the surface and improve laser absorption. We characterized the physical effect of the exposure on the sample as well as the fold angle as a function of laser passes and demonstrate the ability to lift weights comparable with circuit packages and passive components. This technique can form complex, multifold structures with integrated electronics; as a demonstrator, we fold a commercial board with a common timing circuit. Laser forming to add a third dimension to printed circuit boards is an important technology to enable the rapid prototyping of complex 3D electronics.

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Section: Resultsmentioning

confidence: 99%

Self-Folding PCB Kirigami: Rapid Prototyping of 3D Electronics via Laser Cutting and Forming

Bachmann

Hanrahan

Dickey

et al. 2022

ACS Appl. Mater. Interfaces

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“…Critical to the success of the laser forming process is appropriate coupling of the laser energy to the material being formed. This coupling can be achieved by selecting the appropriate laser wavelength that corresponds to the absorption maximum of the substrate [75,88], by using a much higher power laser, so sufficient energy is absorbed by the substrate even with low absorptivity, or by using an absorbing coating layer that is matched with the laser wavelength being used ( Figure 6) [85,89]. Metals thicker than 100 nm are optically opaque [90] and do not transmit appreciable amounts of light, so the metal substrates that have been used in laser forming will primarily either reflect or absorb the laser energy.…”

Section: Laser and Substrate Selectionmentioning

confidence: 99%

“…The percentage of the incoming laser energy that is reflected is called the reflectance and these values have been measured as a function of wavelength [91]. The most common lasers [27] used for laser forming are Nd:YAG lasers that operate at 1.064 µm [57,58,76,78,85,86,92,93] and CO 2 lasers that emit at 10.6 µm [39,50,54,68,89,[94][95][96]. CO 2 lasers are common in industrial setting, as they were one of the first gas lasers developed [97] and exhibit a high energy efficiency, while operating as a continuous-wave mode at high average powers (>1 kW); however, their absorption into metals is low and an absorbing coating is often required.…”

Section: Laser and Substrate Selectionmentioning

confidence: 99%

Making Light Work of Metal Bending: Laser Forming in Rapid Prototyping

Bachmann

Dickey

Lazarus

2020

QuBS

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Lasers can be used to bend 2D metal sheets into complex 3D objects in a process called ‘laser forming.’ Laser forming bends metal sheets by locally heating the sheets to generate plastic strains and is an established metal bending technology in the shipbuilding industry. Recent studies have investigated the laser forming of thin metal parts as a complementary rapid prototyping technology to metal 3D printing. This review discusses the laser forming process, beginning with the mechanisms before covering various design considerations. Laser forming for the rapid manufacturing of metal parts is then reviewed, including the recent advances in process planning, before highlighting promising future research directions.

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“…A wide range of metallic materials have been treated via LBF for bending and welding purposes, e.g., AISI 1010 [5,7,[13][14][15] and S275 [8] mild steels, AISI 302 [11,16] and AISI 304 [4,6,11,12,17] stainless steels, AA 6013 aluminum alloy under both annealed and as-welded conditions [18,19], AA 2024-T3 aluminum alloy, and Ti6Al4V titanium alloy [3]. In addition, the influence of material properties on the LBF process has been addressed via numerical simulations in terms of the relationship between the final bending angle and material parameters, such as the Young's modulus, yield strength, thermal expansion coefficient, specific heat, and thermal conductivity [20].…”

Section: Introductionmentioning

confidence: 99%

Experimental and Simulation Analysis of Effects of Laser Bending on Microstructures Applied to Advanced Metallic Alloys

Ramos-Moore

Hoffmann

Siqueira³

et al. 2021

Metals

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The aim of this work is the analysis of laser beam forming (LBF) in the bending of two relevant materials used in the transportation industry—interstitial-free (IF) steel and AA6013 high-strength aluminum alloy. Our experiments and numerical simulations consider two different operating scenarios achieved by varying the laser beam scanning velocity using linear paths. The material behavior during this process is described via a coupled thermomechanical-plasticity-based formulation that allows prediction of temperature profiles and bending angles. Metallography, glow discharge optical emission spectroscopy, and X-ray diffraction are used for microstructure characterization. In addition, microstress analyses are performed in order to study the stress behavior of the irradiated zones. It is found that LBF mainly induces grain growth and melting in the case of high surface temperatures. Before melting, the materials developed compressive stresses that could be useful in preventing cracking failures. The resulting bending angles are predicted and experimentally validated, indicating the robustness of the model to estimate LBF effects on advanced alloys. The present analysis relating bending angles together with temperature and microstructure profiles along the thickness of the sheets is the main original contribution of this work, highlighting the need for further modeling refinement of the effects of LBF on advanced alloys to include more microstructural properties, such as grain boundary diffusion and surface roughness.

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Laser Forming of Mild Steel Sheets Using Different Surface Coatings

Cited by 12 publications

References 13 publications

Self-Folding PCB Kirigami: Rapid Prototyping of 3D Electronics via Laser Cutting and Forming

Self-Folding PCB Kirigami: Rapid Prototyping of 3D Electronics via Laser Cutting and Forming

Making Light Work of Metal Bending: Laser Forming in Rapid Prototyping

Experimental and Simulation Analysis of Effects of Laser Bending on Microstructures Applied to Advanced Metallic Alloys

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