Packaging test chip for flip-chip and wire bonding process characterization

Schwizer, J.; Song, Wenjing; Mayer, Michael; Brand, Oliver; Baltes, H.

doi:10.1109/sensor.2003.1215348

Cited by 12 publications

(10 citation statements)

References 4 publications

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“…This section of the article attempts to verify experimentally whether this is the case. Many versions of stress-measurement chips have been developed within the last decade in order to measure residual stresses during curing and subsequently optimise the heating process [15][16][17][18][19][20][21]. The chip used in this study was developed by Robert Bosch GmbH as part of the BMBF-funded project iForceSens [19].…”

Section: In-package Stress Measurementmentioning

confidence: 99%

Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-Ended Microwave Curing System

Adamietz

Desmulliez

Pavuluri

et al. 2019

IEEE Trans. Compon., Packag. Manufact. Technol.

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Abstract-In this paper, the influence of microwave curing on the reliability of a representative electronic package is examined by reliability testing and measurement of residual stresses. A LM358 voltage regulator die was mounted to an open Quad Flat No-leads package (QFN) for reliability testing. For the stress measurement, a specifically designed stress measurement die was mounted to the QFN package. The chips were encapsulated with_Hysol EO1080 thermosetting polymer material. Curing was performed using an open-ended microwave oven system equipped with in situ temperature control. Three different temperature profiles for microwave curing were selected according to the requested degree of cure and chemical composition of the cured material. A convection cure profile was selected for the control group samples. Thermal cycling and HAST tests were performed on a total number of 80 chips. 95 QFN packages with stress measurement chips were also manufactured. Increased lifetime expectancy of the microwave cured packaged chips was experimentally demonstrated and measured between 62% to 149% increased lifetime expectancy after Temperature Cycling Test (TCT), and between 63% and 331% after highly Accelerated Ageing Test (HAST) and TCT compared to conventionally cured packages. Analysis of specifically designed stress test chips showed significantly lower residual stresses ranging from 26 MPa to 58.3 MPa within the microwave cured packages compared to conventionally cured packaged chips which displayed residual stresses ranging from 54 MPa to 80.5 MPa. This article therefore provides additional confidence in the industrial relevance of the microwave curing system and its advantages compared to traditional convection oven systems.

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Section: In-package Stress Measurementmentioning

confidence: 99%

Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-Ended Microwave Curing System

Adamietz

Desmulliez

Pavuluri

et al. 2019

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…The packaging incorporated several discrete components connected using wire-bonding and chip-on-board technologies [35]. The overall size is 36 mm long and 12 mm in diameter.…”

Section: Integration To a Microscale Device Format And In Situ Rf mentioning

confidence: 99%

A Programmable Microsystem Using System-on-Chip for Real-time Biotelemetry

Wang

Johannessen

Hammond

et al. 2005

IEEE Trans. Biomed. Eng.

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Abstract-A telemetry microsystem, including multiple sensors, integrated instrumentation and a wireless interface has been implemented. We have employed a methodology akin to that for System-on-Chip microelectronics to design an integrated circuit instrument containing several "intellectual property" blocks that will enable convenient reuse of modules in future projects. The present system was optimized for low-power and included mixed-signal sensor circuits, a programmable digital system, a feedback clock control loop and RF circuits integrated on a 5 mm 5 mm silicon chip using a 0.6 m, 3.3 V CMOS process. Undesirable signal coupling between circuit components has been investigated and current injection into sensitive instrumentation nodes was minimized by careful floor-planning. The chip, the sensors, a magnetic induction-based transmitter and two silver oxide cells were packaged into a 36 mm 12 mm capsule format. A base station was built in order to retrieve the data from the microsystem in real-time. The base station was designed to be adaptive and timing tolerant since the microsystem design was simplified to reduce power consumption and size. The telemetry system was found to have a packet error rate of 10 3 using an asynchronous simplex link. Trials in animal carcasses were carried out to show that the transmitter was as effective as a conventional RF device whilst consuming less power.

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“…Especially the combination of different methods is a new and promising approach. The conjunction of simulation tools and experimental data for validation of the models was a successful step in the field of microelectronic packaging (Schwizer and al 2003;Suhling and Jaeger 2001;Bartholomeyczik et al 2005). In this paper a method is developed to transfer this success into the field of MEMS packages.…”

Section: Introductionmentioning

confidence: 99%

A silicon test chip for the thermomechanical analysis of MEMS packagings

2008

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This paper reports on a method for the investigation of mechanical stress on MEMS sensor and actuator structures due to packaging processes. A silicon test chip is developed and manufactured to validate the simulation results. Finite element analysis (FEA) is used to optimize the geometric parameters and to find a stress sensitive sensor geometry. A diaphragm structure is used as mechanical amplifier for bulk induced stresses during the packaging process. Piezo resistive solid state resistors are doped into the surface of the chip to measure the stress in the diaphragms and at the contact pads being most significant locations for analysis. A high precision ohmmeter was used to measure the resistance prior and past the packaging process. The captured data allows for computation of the resulting stress loads in magnitude. Therefore, a stress evaluation of different packaging technologies is conducted and the impact of the packaging process on reliability can be estimated immediately.

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Packaging test chip for flip-chip and wire bonding process characterization

Cited by 12 publications

References 4 publications

Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-Ended Microwave Curing System

Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-Ended Microwave Curing System

A Programmable Microsystem Using System-on-Chip for Real-time Biotelemetry

A silicon test chip for the thermomechanical analysis of MEMS packagings

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