2014 16th European Conference on Power Electronics and Applications 2014
DOI: 10.1109/epe.2014.6910965
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Packaging for power semiconductors based on the 3D printing technology Selective Laser Melting

Abstract: In this paper a new packaging technique based on Selective Laser Melting is presented which tries to replace solder or sinter layers, respectively bond wires. Following the intended contact geometry and concept, simulations show the influence of the contact geometry on the thermo-mechanical stress the device is committed to. First investigations on the constraints of the production process are represented. Finally the feasibility of the proposed packaging technique is shown.

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Cited by 20 publications
(6 citation statements)
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“…Most strict regulations worldwide are introduced for medical devices, and the materials used in such applications are evaluated in depth for their reliability, safety, and effectiveness [ 39 ]. The development of such composite materials to be introduced in SLA AM technology could enable the development of stiff reliable composites with advanced electrical conductivity properties [ 40 , 41 , 42 ], antibacterial performance [ 14 , 31 , 43 ], etc. In this way, the manufacturing capabilities would be greatly increased, while the manufacturing cost could be reduced with the introduction of AM technology.…”
Section: Introductionmentioning
confidence: 99%
“…Most strict regulations worldwide are introduced for medical devices, and the materials used in such applications are evaluated in depth for their reliability, safety, and effectiveness [ 39 ]. The development of such composite materials to be introduced in SLA AM technology could enable the development of stiff reliable composites with advanced electrical conductivity properties [ 40 , 41 , 42 ], antibacterial performance [ 14 , 31 , 43 ], etc. In this way, the manufacturing capabilities would be greatly increased, while the manufacturing cost could be reduced with the introduction of AM technology.…”
Section: Introductionmentioning
confidence: 99%
“…The most significant development and maturity appear in the heat sinks and semi-open fin channels methods. These methods can also be used for power electronics devices, which opens the door for new and novel approaches called integrated electrical machines and drives (IMD) or integrated modular machines and drives (IMMD) [69], [70], [71], [72], and [73]. The main aim of these new approaches is the augmentation of power density and heat extraction.…”
Section: Discussionmentioning
confidence: 99%
“…Therefore, thermal management is one of the key considerations in these novel techniques. Several universities and R&D centers consider integrating drives and electrical machines such RWTH Aachen [72] (investigating the Si-diode chip with AM metallization to the vertical pin heat sink), Oak Ridge National Laboratory [73] (considering the AM SiC inverter with integrated cooling), and Rolls Royce central Technology [69] (integrated the DC rectifier with liquid heat sink cooling).…”
Section: Discussionmentioning
confidence: 99%
“…Another aspect in realization of complete additively manufactured electrical machine is the integration of power electronics, research in which has also been initiated. Efforts in micro-scale laser based AM to produce structures below 100 µm resolution may enable integration of power electronics with the electrical machines, that will enable production of integrated motor drives resulting in compact electrical machines for high performance demanding applications like in automotive and aerospace industry [76,77].…”
Section: Holistic Approachmentioning
confidence: 99%