Packaging and qualification of MEMS-based space systems

Muller, Lilac; Hecht, Michael H.; Miller, L. M.; Rockstad, Howard K.; Lyke, Jim

doi:10.1109/memsys.1996.494033

Cited by 12 publications

(4 citation statements)

References 6 publications

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“…Grisel et al [13] designed a special process to package micro-chemical sensors. Special processes have also been developed for MEMS packaging, such as packaging for microelectrode [14], packaging for biomedical systems [15] and packaging for space systems [16]. These specially designed, device oriented packaging methods are aimed for individual systems.…”

Section: A Mems Packaging Researchmentioning

confidence: 99%

MEMS post-packaging by localized heating and bonding

Liu

2000

IEEE Trans. Adv. Packag.

158

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This work addresses important post-packaging issues for microsystems and recommends specific research directions by localized heating and bonding. Micropackaging has become a major subject for both scientific research and industrial applications in the emerging filed of microelectromechanical systems (MEMS). Establishing a versatile post-packaging process not only advances the field but also speeds up the product commercialization cycle. A review of engineering bases describing current technologies of MEMS packaging and wafer bonding is followed by an innovative post-packaging approach by localized heating and bonding. Process demonstrations by selective encapsulation are presented, including an integrated low pressure chemical vapor deposition (LPCVD) sealing process, localized silicon-gold eutectic bonding, localized silicon-glass fusion bonding, localized solder bonding and localized CVD bonding processes.

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Section: A Mems Packaging Researchmentioning

confidence: 99%

MEMS post-packaging by localized heating and bonding

Liu

2000

IEEE Trans. Adv. Packag.

158

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“…The launch environment includes extended storage prior to launch, the actual launch of the spacecraft, and the aerodynamic buffeting of the vehicle during its ascent, which imposes severe vibration, along with acoustic, shock, and depressurization loads [12]. The space environment in which the MEMS devices operate has temperature extremes, radiation effects, plasma effects, and atomic oxygen hazards [13][14][15]. A summary of these space environmental survival and operational requirements is listed in Table 1 [16].…”

Section: Introductionmentioning

confidence: 99%

Failure Analysis of Thermal Actuators, Comb Drives, and Other Microelectromechanical Elements

Tan

Weber

Dharan

2007

J Fail. Anal. and Preven.

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This paper reports on an investigation in which several standard Microelectromechanical Systems (MEMS) elements consisting of thermal actuators, inchworm drives, and comb drives were subjected to vibration loading representative of the environment seen in space applications. Finite-element analysis of the MEMS devices showed that sufficient margins existed under the expected environmental loading. Vibration testing, however, resulted in several failures in the devices, and analysis showed that progressive failure initiated from large local displacements. Debris transport and entrapment was another source of failure leading to shorting of thermal actuators. The results illustrate the importance of debris control and packaging design for reliable MEMS operation. Suggestions for improving the reliability of MEMS devices through practical layout and packaging guidelines are made.

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“…Differences include a unique set of failure modes due to the mechanical nature of MEMS. These failure modes are still not well understood [2].…”

Section: Introductionmentioning

confidence: 99%