Finite element simulation of package stress in transfer molded MEMS pressure sensors

Krondorfer, Rudolf; Kim, Yeong K.; Kim, Jaeok; Gustafson, Claes-Göran; Lommasson, T.

doi:10.1016/j.microrel.2004.05.020

Cited by 40 publications

(12 citation statements)

References 11 publications

(10 reference statements)

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“…Finite element analysis (FEA) has been commonly used to simulate multiphysics effects of MEMS structures [9][10][11]. However, MEMS designers are continually reaching FEA limits due to excessive demands on CPU-time and memory resources [12].…”

Section: Introductionmentioning

confidence: 99%

Coupled electrothermal–mechanical analysis for MEMS via model order reduction

Binion¹,

Chen²

2010

Finite Elements in Analysis and Design

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Section: Introductionmentioning

confidence: 99%

Coupled electrothermal–mechanical analysis for MEMS via model order reduction

Binion¹,

Chen²

2010

Finite Elements in Analysis and Design

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“…However, low throughput and a large packaging volume are not suitable for portable commercial products. To be SMD compatible, researchers have proposed a variety of plastic packaging techniques in which the pressure sensors are initially adhered to a lead-frame substrate, and then encapsulated using a suitable plastic molding compound [5][6][7][8]. However, the extra-space that is reserved for the lead-frame substrates used in these techniques inevitably increases the package size.…”

Section: Introductionmentioning

confidence: 99%

A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach

Chen

Cheng

2009

Sensors and Actuators A: Physical

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“…Besides the analytical efforts, the temperature-dependent behavior of a packaged MEMS was mostly simulated using FEM. The simulation covers a wide variety of devices, including resonators (De Anna et al 1999), accelerometers (Li and Tseng 2001;Zhang and Tee 2004;Zhang et al 2007), pressure sensors (Chiou 2003;Meyyappan et al 2003;Krondorfer et al 2004;Peng et al 2005;Lee et al 2006), etc., and the packaging scheme includes dual-in-package, ball grid array, chip scale package, chip on board, flip chip on board, etc. Most of the simulations were conducted in combination with experiments and prototype tests.…”

Section: Introductionmentioning

confidence: 99%

Influence of environmental temperature on the dynamic properties of a die attached MEMS device

Song

Huang

et al. 2009

Microsyst Technol

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Die attach is one of the major processes that may induce unwanted stresses and deformations into micro-electro-mechanical systems (MEMS). The thermoelastic coupling between the die and package may affect the performance of MEMS under various temperature loads, causing unreasonable effects of the output signal, such as zero offset, temperature coefficient of offset (TCO), nonlinearity, ununiformity and hysteresis, etc. A complete characterization of these effects is critical for a more reliable design. This work presents experimental studies of the temperature effects on the dynamic properties of MEMS. Microbridges and strain gauges with different dimensions were used as test structures. They were surface-micromachined on test chips and the chips were die attached on organic laminate substrates using epoxy bonding as well as tape adhering. The material and dimension of the substrate were specially defined to amplify the magnitude of the coupled deformation for the convenience of investigation. Modal frequencies of the microbridges under a set of controlled environmental temperature before and after die attach were measured using a laser Doppler vibrometer system. The average initial residual strain was also measured from the strain gauges to help analyze the dynamic behavior. Nonlinear TCO of the frequencies were observed to be as large as 2,500-5,000 ppm for the epoxy-bonded samples, in contrast with much smaller values for the tape-adhered and unpackaged ones. The frequencies recovered to their original values beyond the curing temperature of the epoxy. A distributed feature was also observed in frequencies of the microbridges with the same length but at different locations of the chip with a maximum relative difference of 20%. The process of thermal cycling and wire bonding was also applied to the samples and caused tender shifts of the frequencies. The experiments reveal major factors that are related to the temperature effects of die attached MEMS and the results are useful for improving the reliability of a package-device co-design.

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Finite element simulation of package stress in transfer molded MEMS pressure sensors

Cited by 40 publications

References 11 publications

Coupled electrothermal–mechanical analysis for MEMS via model order reduction

Coupled electrothermal–mechanical analysis for MEMS via model order reduction

A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach

Influence of environmental temperature on the dynamic properties of a die attached MEMS device

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