Package Design Improvement for Wire Shorting Resolution

Abstract

New devices and new technologies in semiconductor industry are getting more complex in terms of package layout, direct materials, and process capability. With the package design complexity, several issues are encountered during the development, and in turn affecting the overall yield of the package. The paper discusses the modification and improvement done on the bond/lead finger where the wire has issues on shorting with the soldermask during wirebonding process. With the design improvement, occurrence of wire shorting to soldermask would be mitigated.