Bond Pad Probe Marks Effect on Intermetallic Coverage

Moreno, Anthony R.; Rodriguez, Rennier S.; Gomez, Frederick Ray I.

doi:10.9734/jerr/2021/v20i117253

“…However, in each ball circle, areas that do not produce the ally compound are called non-IMC areas. According to experience, the IMC area needs to be greater than 80% (Moreno et al, 2021) of the ball circle area to ensure the bonding strength. The specifications and attributes of the five responses are shown in Table 4.…”

Section: Methodsmentioning

confidence: 99%

Multi-response optimization of IC wire bonding for large probe marks by the RSM and desirability function approach

Chiu

¹

,

Wang

²

,

Lu

³

2022

Int J Adv Manuf Technol

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Wire bonding is key to high-quality IC assembly in semiconductor packaging. An electrical test was conducted before wire bonding. During the electrical test, the needle probes touched the surface of each bond pad resulting in a probe trace left, called probe marks. The probe mark on the bond pad affects the adhesion between the bond pad and copper ball. Generally, the bond ball can be removed easily under shear testing if the ratio of probe mark area to pad area is greater than 20%. A large probe mark causes a defect in the yield. However, rejecting the orders of wafer batches with large probe marks will result in a loss of market share and good relationships with clients. In order to find the optimal parameter settings for the batches of chips with probe mark areas larger than 20% and deal with multiple response problems, this study aims to optimize the parameters of operation for the IC with large probe marks in the wire bonding process to improve process capability and production yield. Response surface methodology (RSM) optimization with the desirability function approach was introduced into the central composite design to obtain the optimal process parameters efficiently and eliminate defects. The optimal parameter settings for the four factors were determined as follows: 90 mA bond power, 12 ms bond time, 10 g bond force, and 180 °C bond temperature. The validation testing confirms that optimal parameter settings increase yield from 98.84% to 99.94% with good process capability, helping companies improve quality, reduce defect costs, and improve customer relationships.

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Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods

Wang

¹

,

Chiu

²

2022

IEEE Trans. Semicond. Manufact.

4

0

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Multi-response Optimization of IC Wire Bonding for Large Probe Marks by the RSM and Desirability Function Approach

Chiu

¹

,

Wang

²

,

Lu

³

2022

Preprint

0

View full text Add to dashboard Cite

Wire bonding is key to high-quality IC assembly in semiconductor packaging. An electrical test was conducted before wire bonding. During the electrical test, the needle probes touched the surface of each bond pad resulting in a probe trace left, called probe marks. The probe mark on the bond pad affects the adhesion between the bond pad and copper ball. Generally, the bond ball can be removed easily under shear testing if the ratio of probe mark area to pad area is greater than 20%. A large probe mark causes a defect in the yield. However, rejecting the orders of wafer batches with large probe marks will result in a loss of market share and good relationships with clients. In order to find the optimal parameter settings for the batches of chips with probe mark areas larger than 20% and deal with multiple response problems, this study aims to optimize the parameters of operation for the IC with large probe marks in the wire bonding process to improve process capability and production yield. Response surface methodology (RSM) optimization with the desirability function approach was introduced into the central composite design to obtain the optimal process parameters efficiently and eliminate defects. The optimal parameter settings for the four factors were determined as follows: 90 mA bond power, 12 ms bond time, 10 g bond force, and 180 °C bond temperature. The validation testing confirms that optimal parameter settings increase yield from 98.84% to 99.94% with good process capability, helping companies improve quality, reduce defect costs, and improve customer relationships.

show abstract

Bond Pad Probe Marks Effect on Intermetallic Coverage

Cited by 4 publications

References 3 publications

Multi-response optimization of IC wire bonding for large probe marks by the RSM and desirability function approach

Multi-response optimization of IC wire bonding for large probe marks by the RSM and desirability function approach

Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods

Multi-response Optimization of IC Wire Bonding for Large Probe Marks by the RSM and Desirability Function Approach

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