Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods

Wang, Chau‐Shing; Chiu, Jing-Er

doi:10.1109/tsm.2022.3162401

Cited by 4 publications

(1 citation statement)

References 26 publications

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“…Wire bonding technology is one of the most critical technologies in the field of semiconductor packaging, which utilizes mechanical energy, ultrasonic energy and thermal energy to connect chips to solder pads on packaging substrates using metal wire [1,2]. Since the 1990s, gold wire bonding has been dominant.…”

Section: Introductionmentioning

confidence: 99%

A Review of Silver Wire Bonding Techniques

An,

Zhou,

Cao

et al. 2023

Micromachines

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The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequently, the reliability of silver wire bonding is discussed, with a focus on analyzing the effects of corrosion, electromigration, and intermetallic compounds on bonding reliability, including the causes and forms of chlorination and sulfurization, the mechanism and path of electromigration, the formation and evolution of intermetallic compounds, and evaluating their impact on bonding strength and reliability. Finally, the development status of silver wire bonding technology is summarized and future research directions for silver wire are proposed.

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Section: Introductionmentioning

confidence: 99%

A Review of Silver Wire Bonding Techniques

An,

Zhou,

Cao

et al. 2023

Micromachines

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Machine learning-based shear force quality prediction of ultrasonic wire bonds: utilizing process data and machine data without additional sensors

Buchner,

Seidler,

Huber

et al. 2024

Int J Adv Manuf Technol

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Ultrasonic wire bonding is a highly automated production process that is used billions of times a year in the electronics and electromobility industries. Due to the complexity of the process and the large number of influencing parameters, there are currently no automated methods that can be used without additional sensors to evaluate the shear force bond quality quantitatively and non-destructively with sufficiently high precision. For this reason, this paper presents a new methodology that uses machine learning to enable quantitative, non-destructive prediction of bond quality without additional sensors. For this purpose, a machine learning algorithm was developed that uses various machine data and process data from existing sensors to quantitatively predict the shear force of the bonded joint. In addition, features are extracted from process time series, such as current, power, and frequency of the ultrasonic generator as well as deformation during bonding. Of the total of 2,090 features considered, the number of features could be reduced to 26 by recursive feature elimination, while maintaining the prediction accuracy. By using optimized deep neural networks, on average, a prediction precision of the regression on the shear force of the source bond of over 89.6% R2-score and a mean absolute error of 241 cN can be achieved.

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