Machine learning-based shear force quality prediction of ultrasonic wire bonds: utilizing process data and machine data without additional sensors

Abstract

Ultrasonic wire bonding is a highly automated production process that is used billions of times a year in the electronics and electromobility industries. Due to the complexity of the process and the large number of influencing parameters, there are currently no automated methods that can be used without additional sensors to evaluate the shear force bond quality quantitatively and non-destructively with sufficiently high precision. For this reason, this paper presents a new methodology that uses machine learning to enable quantitative, non-destructive prediction of bond quality without additional sensors. For this purpose, a machine learning algorithm was developed that uses various machine data and process data from existing sensors to quantitatively predict the shear force of the bonded joint. In addition, features are extracted from process time series, such as current, power, and frequency of the ultrasonic generator as well as deformation during bonding. Of the total of 2,090 features considered, the number of features could be reduced to 26 by recursive feature elimination, while maintaining the prediction accuracy. By using optimized deep neural networks, on average, a prediction precision of the regression on the shear force of the source bond of over 89.6% R2-score and a mean absolute error of 241 cN can be achieved.