P-105: Low Leakage Organic Backplanes for Low Power and High Pixel Density Flexible Displays

Agostinelli, Tiziano; Yağlıoğlu, Burağ; Horne, Ian; Markham, Steve

doi:10.1002/sdtp.10989

Cited by 7 publications

(2 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…1(b)). The OTFT backplane was fabricated with a top-gate bottom-contact (TGBC) structure on polyethylene naphthalate (PEN) substrate [41]. With the bottom-contact structure, the source/drain electrodes were deposited before the OSC layer, so that the mature metallization techniques with sputtering and photolithography were conveniently used for micrometerresolution electrode patterns.…”

Section: Experimental Methodsmentioning

confidence: 99%

Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging

Hou

Chen

Tang

et al. 2022

IEEE J. Electron Devices Soc.

View full text Add to dashboard Cite

A facile blade-coating process is developed for large area deposition of uniform thick organic active layers in organic photodiodes (OPDs). Large-area semi-transparent top metal electrodes are thermally evaporated with an optimal deposition rate to achieve good balance between transparency and conductivity for top illumination integration structure with the organic thin-film transistor (OTFT) backplane. The maximum process temperature of the OPD is 85 ℃, so that the performance of the OTFT underneath is not affected. Based on the developed integration structure and processes, an all-organic integrated flexible active-matrix imager is developed, having the largest size (130 mm × 130 mm), highest resolution (1536 ×1536 pixels, 300 ppi) and lowest process temperature (100 ℃) reported so far for the OPD based imagers.

show abstract

Section: Experimental Methodsmentioning

confidence: 99%

Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging

Hou

Chen

Tang

et al. 2022

IEEE J. Electron Devices Soc.

View full text Add to dashboard Cite

show abstract

“…The sensor matrix is integrated on a foil called frontplane. The frontend and addressing electronics are based on a commercial OTFT technology [14]. The frontend matrix (called here backplane) shares the same pitch as the sensor matrix (Fig.…”

Section: System Specificationsmentioning

confidence: 99%

Organic Pressure-Sensing Surfaces Fabricated by Lamination of Flexible Substrates

Fattori

Abdinia

Pauer

et al. 2018

IEEE Trans. Compon., Packag. Manufact. Technol.

View full text Add to dashboard Cite

DOI to the publisher's website. • The final author version and the galley proof are versions of the publication after peer review. • The final published version features the final layout of the paper including the volume, issue and page numbers. Link to publication General rights Copyright and moral rights for the publications made accessible in the public portal are retained by the authors and/or other copyright owners and it is a condition of accessing publications that users recognise and abide by the legal requirements associated with these rights. • Users may download and print one copy of any publication from the public portal for the purpose of private study or research. • You may not further distribute the material or use it for any profit-making activity or commercial gain • You may freely distribute the URL identifying the publication in the public portal. If the publication is distributed under the terms of Article 25fa of the Dutch Copyright Act, indicated by the "Taverne" license above, please follow below link for the End User Agreement:

show abstract

9‐4: Low Leakage Organic Backplanes for High Pixel Density Optical Sensors

Banach

Markham

Agaiby

et al. 2018

Symp Digest of Tech Papers

Self Cite

View full text Add to dashboard Cite

show abstract

P-105: Low Leakage Organic Backplanes for Low Power and High Pixel Density Flexible Displays

Cited by 7 publications

References 9 publications

Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging

Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging

Organic Pressure-Sensing Surfaces Fabricated by Lamination of Flexible Substrates

9‐4: Low Leakage Organic Backplanes for High Pixel Density Optical Sensors

Contact Info

Product

Resources

About