2011
DOI: 10.1016/j.jnoncrysol.2010.11.116
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Oxygen-excess amorphous SiO2 with 18O-labeled interstitial oxygen molecules

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Cited by 3 publications
(7 citation statements)
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“…At F ≃ 9 J cm –2 , the decrease in f * was the largest during the irradiation. At smaller F values, in contrast, f * changed most significantly during the thermal annealing between 200 and 500 °C, and the temperature range was lower by ∼400 °C than that of conventional thermal oxygen exchange in an unirradiated sample …”
Section: Resultsmentioning
confidence: 85%
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“…At F ≃ 9 J cm –2 , the decrease in f * was the largest during the irradiation. At smaller F values, in contrast, f * changed most significantly during the thermal annealing between 200 and 500 °C, and the temperature range was lower by ∼400 °C than that of conventional thermal oxygen exchange in an unirradiated sample …”
Section: Resultsmentioning
confidence: 85%
“…The initial concentration of interstitial O 2 was ∼4 × 10 17 cm –3 . Under the loading condition, the 18 O fraction of interstitial O 2 , f *, was ∼0.9 . The slight decrease in f * from the 18 O isotopic purity of 18 O 2 gas is due to the oxygen exchange with the Si– 16 O–Si network during the thermal O 2 loading, and SiOH and SiF groups in a -SiO 2 do not promote this process .…”
Section: Resultsmentioning
confidence: 92%
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