Oxidized low density polyethylene: A potential cost-effective, stable, and recyclable polymeric encapsulant for photovoltaic modules

Hsu, Hsien‐Yi; Hsieh, Hsin-Hsin; Hwang, Jen-Loong

doi:10.1016/j.solmat.2010.01.020

Cited by 25 publications

(15 citation statements)

References 20 publications

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“…Thus, DH testing can cause degradation of the encapsulant between glass and solar cell which can be correlated with a lateral diffusion of water (Peike et al, 2011). Other works stated a reduction of optical properties by increasing absorption that was translated in a reduction of light transmission (McIntosh and et al, 2011) and as well as changes in yellowness-index (Hsu and et al, 2010). But also degradation effects caused by hydrolysis, e.g.…”

Section: Introductionmentioning

confidence: 99%

Simulation of water ingress into PV-modules: IEC-testing versus outdoor exposure

Hülsmann

Weiß

2015

Solar Energy

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Section: Introductionmentioning

confidence: 99%

Simulation of water ingress into PV-modules: IEC-testing versus outdoor exposure

Hülsmann

Weiß

2015

Solar Energy

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“…However, EVA is prone to yellowing, bubble formation, and low volume resistivity, which can substantially reduce photovoltaic cell efficiencies . This has led to the greater use of hydrocarbon-based POs, which have a better stability and a higher volume resistivity and possess volume resistivities 2 orders of magnitude greater than those of EVA, providing a lower potential-induced degradation (PID). , As a result, it is expected that the market share for POs will continue to increase over the next decade…”

Section: Introductionmentioning

confidence: 99%

“…5 This has led to the greater use of hydrocarbon-based POs, which have a better stability and a higher volume resistivity and possess volume resistivities 2 orders of magnitude greater than those of EVA, providing a lower potential-induced degradation (PID). 6,7 As a result, it is expected that the market share for POs will continue to increase over the next decade. 8 There are two types of polyolefins for photovoltaic encapsulation: thermoplastic and cross-linked polyolefins.…”

Section: ■ Introductionmentioning

confidence: 99%

Vinyl-Functionalized Polyolefins for Fast Photovoltaic Cell Encapsulation

Luo

Liu

Zhang

et al. 2020

ACS Appl. Polym. Mater.

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Polyolefins (POs) are considered a promising candidate for photovoltaic cell encapsulation due to their high volume resistivity, low water-vapor permeability, and outstanding outdoor stability. However, POs without functionalization have a low rate of cross-linking, which significantly slows the solar cell encapsulation process. Herein, we describe the use of a polymer product-engineering approach in which reactive pendent vinyl groups are controllably incorporated in PO polymer chains to accelerate their cross-linking reactions. The POs having limited vinyl functionalities of 0.02−0.37 mol % were synthesized via the copolymerization of ethylene, 1-octene, and vinylnorbornene or 1,9-decadiene at different monomer concentrations. The vinyl groups in the POs readily react with curing agents, increasing crosslinking rates by 14-fold up to 179.7 Pa•s −1 , as measured by the enhancement of the storage modulus (G′). The maximum G′ value representing the melt strength was also increased from 11.3 to 69.0 kPa due to the high curing degree in the POs. The use of a curing agent could be reduced by 50%, and no curing coagent was required in the PO curing process. The vinyl-functionalized POs had a light transmittance of 91%, a good volume resistivity of 7.05 × 10 16 Ω•m, a low water-vapor permeability of 2.31 × 10 −12 g•m•m −2 • s −1 •Pa −1 , and an improved mechanical strength after curing. The damp-heat and UV aging had little effect on their light transmittance. Our approach of synthesizing functional POs with pendent vinyl groups thus promises the development of new highperformance polymer materials for photovoltaic cell encapsulation.

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“…In the electronics industry, in order to strengthen the integrity of the electronic devices, improve the stability of the component parameters, and prolong the service life of the electronic devices, it is often necessary to encapsulate the delicate electronic components to provide protection from moisture, corrosive agents, ultraviolet radiation, mechanical vibrations, and thermal shocks. 1 Currently, there are some kinds of electronic encapsulants, such as epoxy, 2 polycarbonate, 3 polyurethane, 4 polyethylene, 5 and silicone materials. [6][7][8] Among them, additioncure silicone encapsulant (ASE) has attracted more and more attention in the field of aerospace, automotive, and electronic devices because of its wide service temperature range, low shrinkage, excellent electrical properties, good thermal stability, excellent resistance to water, chemicals, ultraviolet radiation and weather, and no toxicity.…”

Section: Introductionmentioning

confidence: 99%

“…Currently, there are some kinds of electronic encapsulants, such as epoxy, 2 polycarbonate, 3 polyurethane, 4 polyethylene, 5 and silicone materials. 6 –8 Among them, addition-cure silicone encapsulant (ASE) has attracted more and more attention in the field of aerospace, automotive, and electronic devices because of its wide service temperature range, low shrinkage, excellent electrical properties, good thermal stability, excellent resistance to water, chemicals, ultraviolet radiation and weather, and no toxicity.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of an adhesion-enhancing polyhydrosiloxane containing acrylate groups and its cross-linked addition-cure silicone encapsulant

Pan

Zeng

et al. 2013

Journal of Elastomers & Plastics

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A novel adhesion-enhancing polyhydrosiloxane containing acrylate groups (MPMS-PHMS) was prepared via the hydrolysis of 3-methacryloyloxypropylmethyldimethoxysilane and the ring-opening polymerization of octamethylcyclotetrasiloxane and tetramethylcyclotetrasiloxane, and was used as cross-linker for addition-cure silicone encapsulant (ASE) with a large amount of alumina as thermally conductive fillers. The chemical structure of MPMS-PHMS was characterized by Fourier transform infrared spectroscopy, proton nuclear magnetic resonance spectroscopy, silicon nuclear magnetic resonance spectroscopy, and gel permeation chromatography. The effect of MPMS-PHMS on the properties of ASE was investigated. The results indicated that when using MPMS-PHMS as cross-linker, the cross-linking density of ASE was much higher than that of ASE using commercial poly(hydromethylsiloxane) cross-linker. It was also found that MPMS-PHMS not only markedly improved the adhesion strength of ASE to aluminum substrate but also significantly enhanced the mechanical properties of ASE. Appropriately increasing cure temperature and prolonging cure time were favorable to improve the adhesion strength of ASE. The optimal content of MPMS-PHMS was 10 phr, and the suitable cure temperature and time were approximately between 130 and 150 C and 2 h, respectively.

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Oxidized low density polyethylene: A potential cost-effective, stable, and recyclable polymeric encapsulant for photovoltaic modules

Cited by 25 publications

References 20 publications

Simulation of water ingress into PV-modules: IEC-testing versus outdoor exposure

Simulation of water ingress into PV-modules: IEC-testing versus outdoor exposure

Vinyl-Functionalized Polyolefins for Fast Photovoltaic Cell Encapsulation

Synthesis of an adhesion-enhancing polyhydrosiloxane containing acrylate groups and its cross-linked addition-cure silicone encapsulant

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