Oxidation on copper lead frame surface which leads to package delamination

Yung, Lai Chin; Ying, Lee Chai; Fei, Cheong Choke; Ann, Aw Tiam; Norbert, Soellner

doi:10.1109/smelec.2012.6417229

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2021

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“…Learnings from this manuscript combined with other ideas mentioned in the literature and in [8][9][10][11][12] would help reinforce and promote a lean and robust manufacturing on all branches of industry.…”

Section: Conclusion and Recommenda-tionsmentioning

confidence: 97%

Digital Exhaust Controller for Pressure Detection on Die Attach Oven Curing Machine

Rosa¹,

Dinglasan²,

Gomez³

2021

JERR

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Innovation on die attach curing process on semiconductor industry play a big role to have a robust process eliminating unwanted gross unit rejection. Resolving failures and hardware breakdowns on the exhaust system of oven curing process are the focus of this paper. Discoloration and contamination due to outgas and fumes that cannot exit the oven chamber are the effects of a failed exhaust system. Addressing the said phenomenon showing simulations, trial runs will be discussed on this paper. Promoting an innovative approach that includes real time monitoring of the system performance, and detection of its failure to prevent continuous operation with failed exhaust system are performed to have an appropriate resolution.

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Section: Conclusion and Recommenda-tionsmentioning

confidence: 97%