Investigation of FeCoNiCu properties: Thermal stability, corrosion behavior, wettability with Sn-3.0Ag-0.5Cu and interlayer formation of multi-element intermetallic compound

Shen, Yu-An; Hsieh, He-Yen; Chen, Shih-Hsun; Li, Jiahui; Chen, Sheng-Wen; Nishikawa, Hiroshi

doi:10.1016/j.apsusc.2021.148931

Cited by 23 publications

(3 citation statements)

References 66 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…One effective way to prevent oxidation of the substrate or solder joint is by using ENIG instead of copper pads. Previous studies reported ENIG has great wettability with SAC solder, and the Ni layer can resist the rapid reaction of Cu with Sn to form thick interfacial IMC [ 25 , 26 ]. As shown in Figure 10 , the enhancement in the soldering strength of Sn-58Bi by ENIG is significant.…”

Section: Resultsmentioning

confidence: 99%

Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature

He,

Jiang,

Shen

et al. 2024

Materials

Self Cite

View full text Add to dashboard Cite

With the continuous reduction of chip size, fluxless soldering has brought attention to high-density, three-dimensional packaging. Although fluxless soldering technology with formic acid (FA) atmosphere has been presented, few studies have examined the effect of the Pt catalytic, preheating time, and soldering pad on FA soldering for the Sn-58Bi solder. The results have shown that the Pt catalytic can promote oxidation–reduction and the formation of a large pore in the Sn-58Bi/Cu solder joint, which causes a decrease in shear strength. ENIG (electroless nickel immersion gold) improves soldering strength. The shear strength of Sn-58Bi/ENIG increases under the Pt catalytic FA atmosphere process due to the isolation of the Au layer on ENIG. The Au layer protects metal from corrosion and provides a good contact surface for the Sn-58Bi solder. The shear strength of the Sn-58Bi/ENIG joints under a Pt catalytic atmosphere improved by 44.7% compared to using a Cu pad. These findings reveal the improvement of the shear strength of solder joints bonded at low temperatures under the FA atmosphere.

show abstract

Section: Resultsmentioning

confidence: 99%

Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature

He,

Jiang,

Shen

et al. 2024

Materials

Self Cite

View full text Add to dashboard Cite

show abstract

“…The corrosion current density (icorr) of D20 sample is 7.0 μA cm −2 . Table S4 shows that the corrosion current density of D20 sample is smaller compared with other HEA [ 55 , 56 ]. This shows that the D20 sample has excellent corrosion resistance due to the synergistic effect between elements of FeCoNiCr 0.4 Cu 0.2 HEAs.…”

Section: Resultsmentioning

confidence: 99%

Microstructure Design of High-Entropy Alloys Through a Multistage Mechanical Alloying Strategy for Temperature-Stable Megahertz Electromagnetic Absorption

et al. 2022

View full text Add to dashboard Cite

Developing megahertz (MHz) electromagnetic wave (EMW) absorption materials with broadband absorption, multi-temperature adaptability, and facile preparation method remains a challenge. Herein, nanocrystalline FeCoNiCr0.4Cu0.2 high-entropy alloy powders (HEAs) with both large aspect ratios and thin intergranular amorphous layers are constructed by a multistage mechanical alloying strategy, aiming to achieve excellent and temperature-stable permeability and EMW absorption. A single-phase face-centered cubic structure with good ductility and high crystallinity is obtained as wet milling precursors, via precisely controlling dry milling time. Then, HEAs are flattened to improve aspect ratios by synergistically regulating wet milling time. FeCoNiCr0.4Cu0.2 HEAs with dry milling 20 h and wet milling 5 h (D20) exhibit higher and more stable permeability because of larger aspect ratios and thinner intergranular amorphous layers. The maximum reflection loss (RL) of D20/SiO2 composites is greater than − 7 dB with 5 mm thickness, and EMW absorption bandwidth (RL < − 7 dB) can maintain between 523 and 600 MHz from − 50 to 150 °C. Furthermore, relying on the “cocktail effect” of HEAs, D20 sample also exhibits excellent corrosion resistance and high Curie temperature. This work provides a facile and tunable strategy to design MHz electromagnetic absorbers with temperature stability, broadband, and resistance to harsh environments.

show abstract

“…This type of alloy has, when compared with a conventional alloy, a very high mixing entropy, which ensures high phase stability [10][11][12][13]. Their method has later been used for the construction of various types of high-entropy alloys, usually in the form of solid solution, bulk metallic glasses, and intermetallic compounds [14].…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Magnetic Field-Induced Strain of a Ni-Mn-Ga-Co-Gd High-Entropy Alloy

Bao

et al. 2021

Materials

View full text Add to dashboard Cite

The effect of a high-entropy design on martensitic transformation and magnetic field-induced strain has been investigated in the present study for Ni-Mn-Ga-Co-Gd ferromagnetic shape-memory alloys. The purpose was to increase the martensitic transition temperature, as well as the magnetic field-induced strain, of these materials. The results show that there is a co-existence of β, γ, and martensite phases in the microstructure of the alloy samples. Additionally, the martensitic transformation temperature shows a markedly increasing trend for these high-entropy samples, with the largest value being approximately 500 °C. The morphology of the martensite exhibits typical twin characteristics of type L10. Moreover, the magnetic field-induced strain shows an increasing trend, which is caused by the driving force of the twin martensite re-arrangement strengthening.

show abstract

Investigation of FeCoNiCu properties: Thermal stability, corrosion behavior, wettability with Sn-3.0Ag-0.5Cu and interlayer formation of multi-element intermetallic compound

Cited by 23 publications

References 66 publications

Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature

Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature

Microstructure Design of High-Entropy Alloys Through a Multistage Mechanical Alloying Strategy for Temperature-Stable Megahertz Electromagnetic Absorption

Microstructure and Magnetic Field-Induced Strain of a Ni-Mn-Ga-Co-Gd High-Entropy Alloy

Contact Info

Product

Resources

About