Overstressed interatomic bonds in stressed polymers

Abstract

A B S T R A C T Infrared (IR) spectroscopy is used to find how the applied mechanical stress imposed upon a sample is distributed among the interatomic bonds. The distribution is highly heterogeneous: 80--95% of the bond population experience stresses close to the applied stress, the stress on the rest of the bond population varies over a wide range and reaches 1000--2000 kg/mm 2. The overstressed interatomic bonds lie in the amorphous regions of the polymer and are oriented in the direction of the mechanical force. The maximum stress on interatomic bonds is determined by the magnitude of the breaking stress on them. The breaking stress is shown to be a function of the applied stress, time, and temperature. This dependence is due to scission of stressed bonds induced by thermal fluctuations.Int. Journ. of Fracture, 11 (1975) 789-801

New approach to the description of young's modulus for highly oriented polymers. ii. Relationship between young's modulus and thermal expansion of polymers over a wide temperature range

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“…Equations (8) and (9) modulus for polymers may be related to thermal expansion of polymer chains and measurement time.…”

Долговечность Полимерных Композитов

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Structural Basis of High‐Strength High‐Modulus Polymers

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