New approach to the description of young's modulus for highly oriented polymers. ii. Relationship between young's modulus and thermal expansion of polymers over a wide temperature range

Bronnikov, Sergei; Vettegren, V. I.; Frenkel, S.Ya.

doi:10.1080/00222349308215470

Cited by 4 publications

(1 citation statement)

References 10 publications

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“…Vettegren et al 28 and Bronnikov et al 29 developed an expression that relates the time and temperature dependent Young's modulus to the material properties of a polymer before loading. Once validated, the empirical expression could be easily incorporated into the joint conductance model, and then the joint conductance model would account for the viscoelastic behavior of polymers.…”

Section: Areas For Future Studymentioning

confidence: 99%

Thermal Contact Conductance of Metal/Polymer Joints: An Analytical and Experimental Investigation

Fuller

Marotta

2001

Journal of Thermophysics and Heat Transfer

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The heat ow across a metal/polymer interface is a very important problem in many modern engineering applications. A thermal joint conductance model that employs the surface mechanics of a contact interface in conjunction with an existing elastic thermal contact conductance model was developed. In developing the model, an elastic contact hardness term was derived to predict the actual contact area of a metal/polymer interface under loading. The model predicts a microscopic resistance region where the interface resistance is dominant and a bulk resistance region where the thermal conductivity of the polymer is dominant. An experimental apparatus was fabricated, and a successful experimental program was conducted. New experimental data were gathered on different polymeric specimens over a pressure range of 138-2758 kPa (20-400 psi). The experimental data were compared to the proposed thermal joint conductance model. It was found that the proposed model predicted the data quite well. The data followed the predicted trends for both the microscopic and bulk resistance regions. Nomenclature A a= apparent area of contact, m 2 A r = real area of contact, m 2 a c = contact radius, m a 0 = Hertzian contact radius, m c = half-width of plane contact area, melastic modulus of polymer, Pa E s = elastic modulus of substrate, Pa H c = contact microhardness, Pa H e = Mikic elastic hardness (E 0 = p 2)£ m, Pa H ep = polymer elastic hardness, Pa h bulk = thermal bulk conductance, W/m 2 K h c = thermal contact conductance, W/m 2 K h e = dimensionless elastic conductance h j = thermal joint conductance, W/m 2 K h j exp = experimentally calculated joint conductance, W/m 2 K h micro = thermal microscopic conductance, W/m 2 K J .t / = creep compliance k ux = thermal conductivity of ux meter, W/m K k p = thermal conductivity of polymer, W/m K k s = harmonic mean thermal conductivity, W/m K L = load, N m ab = mean absolute asperity slope, rad n = number of contact spots per unit area of apparent contact, m ¡2 P = apparent pressure, Pa P=H c = dimensionless plastic contact pressure P=H e = dimensionless elastic contact pressure P m = mean pressure at interface, Pa Q = heat rate, W q = heat ux through ux meter, W/m 2 R b = bulk thermal resistance, K/W R g;1 = gap resistance at interface 1, K/W R g;2 = gap resistance at interface 2, K/W R j = joint resistance, K/W R micro = microscopic thermal resistance, K/W R t;c = contact resistance, K/W R 1 = thermal resistance for upper interface, K/W R 2 = thermal resistance for lower interface, K/W T c = temperature of specimen, K T sl = temperature of lower interface of specimen, K T su = temperature of upper interface of specimen, K T 1 = temperature at surface 1, K T 2 = temperature at surface 2, K t = elastic layer (polymer) thickness, m t f = polymer thickness after loading, m t 0 = polymer thickness before loading, m t ¤ = critical polymer thickness, m Y = separation distance between contacting surfaces, m Y .t / = relaxation modulus " p = strain on polymer in the vertical directioņ = dimensionle...

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Section: Areas For Future Studymentioning

confidence: 99%

Thermal Contact Conductance of Metal/Polymer Joints: An Analytical and Experimental Investigation

Fuller

Marotta

2001

Journal of Thermophysics and Heat Transfer

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Problems of the Physics of the Oriented State of Polymers

Frenkel¹

1996

Oriented Polymer Materials

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Introductory considerationsI preferred this subtitle to "Introductory notes" for the following reasons.Quite a lot is already written on orientation phenomena and physical properties of oriented polymers, and it would be difficult and even senseless to present something substantionally new on this subject using common terms and formalism. An additional difficulty arises from the fact that a similar contribution [l] is supposed to appear. Therefore, to avoid autoplagiary, I have to discuss most of the problems considered in the preceding paper in a quite different manner, paying special attention to molecular cybernetics and to systemic analysis connected with a special formulation of Bohr's complementarity principle, resulting from the recent difficulty (if not impossibility) to treat in comprehensible and/or graphic terms the multidimensional state trajectories, attractors, fractals and transitions of fractional order appearing in modern physics and particularly unavoidable when dealing with polymers.

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Description of the mechanical relaxation of highly oriented polymers based on their relaxation spectra

Bronnikov

Vettegren

1996

Mech Compos Mater

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New approach to the description of young's modulus for highly oriented polymers. ii. Relationship between young's modulus and thermal expansion of polymers over a wide temperature range

Cited by 4 publications

References 10 publications

Thermal Contact Conductance of Metal/Polymer Joints: An Analytical and Experimental Investigation

Thermal Contact Conductance of Metal/Polymer Joints: An Analytical and Experimental Investigation

Problems of the Physics of the Oriented State of Polymers

Description of the mechanical relaxation of highly oriented polymers based on their relaxation spectra

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