2008
DOI: 10.1109/led.2008.2000843
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Origin of the Asymmetry in the Magnitude of the Statistical Variability of n- and p-Channel Poly-Si Gate Bulk MOSFETs

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Cited by 49 publications
(26 citation statements)
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“…In order to save computing time we have simulated square 42×42nm devices, which have SiO 2 oxide thickness of 1.7nm. Our previous studies of statistical variability in fresh n-and p-channel 45nm LP transistors yielded excellent agreement with measurements [12,13]. The simulations were carried out with the Glasgow 3D 'atomistic' simulator, which deploys fine grain discretisation and density gradient quantum corrections accurately resolving the contribution of individual discrete dopants and trapped charges [5].…”
Section: Simulation Methodologymentioning
confidence: 75%
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“…In order to save computing time we have simulated square 42×42nm devices, which have SiO 2 oxide thickness of 1.7nm. Our previous studies of statistical variability in fresh n-and p-channel 45nm LP transistors yielded excellent agreement with measurements [12,13]. The simulations were carried out with the Glasgow 3D 'atomistic' simulator, which deploys fine grain discretisation and density gradient quantum corrections accurately resolving the contribution of individual discrete dopants and trapped charges [5].…”
Section: Simulation Methodologymentioning
confidence: 75%
“…Details about the device structure and doping profiles are published elsewhere [12,13]. We simulate NBTI variability associated with fixed/trapped random positive charges in concert with all other variability sources relevant for this technology.…”
Section: Simulation Methodologymentioning
confidence: 99%
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“…However, in the pchannel MOSFET case the combined effect of just the RDD and LER is sufficient to reproduce accurately the experimental measurements. The reason for this is the presence of acceptor type interface states in the upper half of the bandgap which pin the Fermi level in the case of n-type poly-Si, and the absence of corresponding donor type interface states in the lower part of the bandgap which leaves the Fermi level unpinned in the case of p-type poly-Si [32].…”
Section: Validation Of the Drift-diffusion Simulation Methodologymentioning
confidence: 99%
“…On the other hand, as the dimensions of MOSFETs are scaled into the nanometer regime, fluctuations in device characteristics due to variations in gate length, discrete dopant fluctuations, line-edge roughness, and so on have become serious problems [3][4][5]. Moreover, the presence of current noise in MOSFETs has recently become a problem even in digital circuits [6].…”
Section: Introductionmentioning
confidence: 99%