Origami/Kirigami‐Guided Morphing of Composite Sheets

Cui, Jianxun; Poblete, Felipe R.; Zhu, Yong

doi:10.1002/adfm.201802768

Cited by 55 publications

(48 citation statements)

References 43 publications

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“…Developing R2R‐compatible printing and post‐printing treatment with a wide range of substrates is key. Creating freestanding electronics in a 3D form or incorporating electronics onto 3D objects (e.g., shape‐adaptable 3D flexible electronics) is an interesting direction for flexible and stretchable electronics . Printing conductive nanomaterials will certainly assist the development of new configurations of electronic devices.…”

Section: Discussionmentioning

confidence: 99%

Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications

Huang

Zhu

2019

Adv Materials Technologies

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344

347

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PE has been explored for the manufacturing of flexible and stretchable electronic devices by printing functional inks containing soluble or dispersed materials, [14][15][16] which has enabled a wide variety of applications, such as transparent conductive films (TCFs), flexible energy harvesting and storage, thin film transistors (TFTs), electroluminescent devices, and wearable sensors. [17][18][19][20][21][22][23][24] The global PE market should reach $26.6 billion by 2022 from $14.0 billion in 2017 at a compound annual growth rate of 13.6%. [25] PE devices are manufactured by a variety of printing technologies. Typical printing technologies can be divided into two broad categories: noncontact patterning (or nozzle-based patterning) and contact-based patterning. The noncontact techniques include inkjet printing, electrohydrodynamic (EHD) printing, aerosol jet printing, and slot die coating, while screen printing, gravure printing, and flexographic printing are examples of the contact techniques. Each of these techniques has its own advantages and disadvantages, but they all rely on the principle of transferring inks to a substrate. Understanding the characteristics and recent advances of each printing technique is important to further the progress in PE. Moreover, to promote the lab-scale printing technologies to large-scale production process, roll-toroll (R2R) printing, which is one of the manufacturing methods to obtain large-area films with low cost and excellent durability, has drawn much attention from both industry and the research community.Nearly all of devices based on PE require conductive structures, interconnects, and contacts; therefore, highly conductive patterns, usually with high transparency and/or high resolution, fabricated by means of printing conductive materials are one of the most critical components in PE devices. Various printable conductive nanomaterials, such as metal nanomaterials (e.g., metal nanoparticles and metal nanowires) and carbon nanomaterials (e.g., graphene and carbon nanotubes (CNTs)), have been explored and used as major materials for PE. Applying printing technology to deposition of the conductive nanomaterials requires formulation of suitable inks. After depositing inks on different substrates, post-printing treatment, Printed electronics is attracting a great deal of attention in both research and commercialization as it enables fabrication of large-scale, low-cost electronic devices on a variety of substrates. Printed electronics plays a critical role infacilitating widespread flexible electronics and more recently stretchable electronics. Conductive nanomaterials, such as metal nanoparticles and nanowires, carbon nanotubes, and graphene, are promising building blocks for printed electronics. Nanomaterial-based printing technologies, formulation of printable inks, post-printing treatment, and integration of functional devices have progressed substantially in the recent years. This review summarizes basic principles and recent development of common printing technologie...

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Section: Discussionmentioning

confidence: 99%

Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications

Huang

Zhu

2019

Adv Materials Technologies

Self Cite

344

347

View full text Add to dashboard Cite

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“…Mechanical properties of composite sandwich structures with piezoelectric were studied by Loja et al, 119 Hasheminejad and Gudarzi, 155 and Konka et al 156 Free vibration and buckling analyses of cylindrical sandwich panel with magnetorheological fluid layer were performed by Malekzadeh et al 157 Damping optimization of hybrid active-passive sandwich composite structures were presented by Araújo et al 158,159 Eshaghi et al 36 reviewed Figure 18. Smart core sandwich structure: (a) SMP 11,14,15,17,142,143 , (b) SMA, (c) piezoelectrics 150,152,153 , and (d) magnetorheological fluids. 36 SMP: shape memory polymer; SMA: shape memory alloy.…”

Section: Novel Core Structurementioning

confidence: 99%

“…The development of smart core sandwich structure is pursued in parallel with the development of smart materials. 11 –17,36,148 –160 Currently, piezoelectrics, SMAs, electrorheological, and magnetorheological fluids are widely used smart materials. Figure 18 shows some typical smart core structures.…”

Section: Core Structure Designmentioning

confidence: 99%

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Creative design for sandwich structures: A review

Feng

Qiu

Gao

et al. 2020

International Journal of Advanced Robotic Systems

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Sandwich structures are important innovative multifunctional structures with the advantages of low density and high performance. Creative design for sandwich structures is a design process based on sandwich core structure evolution mechanisms, material design method, and panel (including core structure and facing sheets) performance prediction model. The review outlines recent research efforts on creative design for sandwich structures with different core constructions such as corrugated core, honeycomb core, foam core, truss core, and folded cores. The topics discussed in this review article include aspects of sandwich core structure design, material design, and mechanical properties, and panel performance and damage. In addition, examples of engineering applications of sandwich structures are discussed. Further research directions and potential applications are summarized.

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“…As a consequence, methods for customized manufacture of such classes of sophisticated 3D mesostructures are of increasing interest. Techniques for these purposes can be categorized into direct-type 3D fabrication (16)(17)(18)(19)(20)(21) and indirect-type 3D assembly (22)(23)(24)(25)(26)(27)(28)(29)(30)(31) schemes, each with advantages and limitations. Of the latter, those based on controlled, in-and out-of-plane buckling of preformed 2D structures provide high levels of versatility in engineering design (22,(32)(33)(34)(35)(36)(37)(38).…”

mentioning

confidence: 99%

Harnessing the interface mechanics of hard films and soft substrates for 3D assembly by controlled buckling

Liu

Wang

Xu³

et al. 2019

Proc. Natl. Acad. Sci. U.S.A.

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Techniques for forming sophisticated, 3D mesostructures in advanced, functional materials are of rapidly growing interest, owing to their potential uses across a broad range of fundamental and applied areas of application. Recently developed approaches to 3D assembly that rely on controlled buckling mechanics serve as versatile routes to 3D mesostructures in a diverse range of high-quality materials and length scales of relevance for 3D microsystems with unusual function and/or enhanced performance. Nonlinear buckling and delamination behaviors in materials that combine both weak and strong interfaces are foundational to the assembly process, but they can be difficult to control, especially for complex geometries. This paper presents theoretical and experimental studies of the fundamental aspects of adhesion and delamination in this context. By quantifying the effects of various essential parameters on these processes, we establish general design diagrams for different material systems, taking into account 4 dominant delamination states (wrinkling, partial delamination of the weak interface, full delamination of the weak interface, and partial delamination of the strong interface). These diagrams provide guidelines for the selection of engineering parameters that avoid interface-related failure, as demonstrated by a series of examples in 3D helical mesostructures and mesostructures that are reconfigurable based on the control of loading-path trajectories. Three-dimensional micromechanical resonators with frequencies that can be selected between 2 distinct values serve as demonstrative examples.

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Origami/Kirigami‐Guided Morphing of Composite Sheets

Cited by 55 publications

References 43 publications

Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications

Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications

Creative design for sandwich structures: A review

Harnessing the interface mechanics of hard films and soft substrates for 3D assembly by controlled buckling

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