2007
DOI: 10.1143/jjap.46.7619
|View full text |Cite
|
Sign up to set email alerts
|

Orientation Dependence of Silicon Oxidation Ratio in High-Pressure Water Vapor

Abstract: We investigated the relative oxidation rates of single-crystalline Si substrates with various orientations to study the formation of thermally grown oxide films on multicrystalline Si at low temperatures in high-pressure water vapor. The oxidation rates depended greatly on the Si substrate orientation, but the increasing pressure did not change the proportion of their relative oxidation ratio even though the oxidation rate was accelerated by the pressure. On the basis of our modeling of the Si surface structur… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2009
2009
2013
2013

Publication Types

Select...
1
1

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(2 citation statements)
references
References 6 publications
0
2
0
Order By: Relevance
“…Rate constants for these planes are available in [7], and they generally follow an Arrhenius temperature dependency allowing for prediction over a wide range of growth temperatures. However, little literature exists on oxide growth between these crystal planes, and that which does exist presents difficulties in application such as being limited to thin or native oxide layers [8], [9]. The growth conditions ultimately determine the structure of the μHSR shown in Figure 1.…”
Section: Hemispherical Mold Oxidationmentioning
confidence: 99%
“…Rate constants for these planes are available in [7], and they generally follow an Arrhenius temperature dependency allowing for prediction over a wide range of growth temperatures. However, little literature exists on oxide growth between these crystal planes, and that which does exist presents difficulties in application such as being limited to thin or native oxide layers [8], [9]. The growth conditions ultimately determine the structure of the μHSR shown in Figure 1.…”
Section: Hemispherical Mold Oxidationmentioning
confidence: 99%
“…3 In this work, the oxidizing ambient was built using high pressure H 2 O vapor at 550°C. For the SPC poly-Si annealed for 1 h at 2 MPa, the oxide thickness is about 150 Å, which well matched with the x-ray photoelectron spectroscopy results.…”
Section: B Annealing Of Polycrystalline Silicon By Heating With Highmentioning
confidence: 99%