Optimizing Die Corner and Optical Groove Corner Crackstop Support Structures for Mitigating Dicing and CPI Risks

Rabie, Mohamed A.; Polomoff, Nicholas A.; Pozder, Scott

doi:10.1109/ectc32696.2021.00223

Cited by 2 publications

(2 citation statements)

References 14 publications

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“…19,23 The crackstops are added to the node's process design kit and processed with the standard processing available to its respective node. Usually, the die corners are more vulnerable 24 to delamination via crack propagation; thus, a crack-stop may be made more robust at the die corners, as shown by Rabie et al, 22 in both layout views and confocal scanning acoustic microscopy images. As seen in the listed references mentioned, the crack-stops or seal rings are made primarily in the back-end-of-line (BEOL) with BEOL processing.…”

Section: Introductionmentioning

confidence: 99%

“…To prevent these types of reliability failures, a traditional crack-stop or seal ring is added to the perimeter of the IC layout to protect the die active area, and this solution with optimization has been effective. Examples of the crack-stop and seal ring layouts have been presented by other authors 19 – 23 along with cross-section images 19 , 23 . The crack-stops are added to the node’s process design kit and processed with the standard processing available to its respective node.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Minimizing die fracture in 3DIC die integration

Bravo,

Morey-Chaisemartin,

Beisser

et al. 2024

J. Micro/Nanopattern. Mats. Metro.

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Background: The demand for high-performance semiconductor products has led to reduced wafer feature size, lowered package size, and an ever-thinner die for advanced three-dimensional (3D) packaging. Dies down to a thickness of 5 μm have been demonstrated. One significant barrier is the fragility of the thin dies, their overall thin form factor, and their impact on yield, reliability, and costs.Aim: We explore the current state of the art in the current crack stop and outline the shortcomings moving forward for stacked 3D integrated circuits (3DIC).Approach: Using a theoretical understanding of fracture mechanics and the new biomimetic concept adapted from nature, we show the implementation of the new crack stop insertions in the die frame for a next-generation 3DIC product. Results:The proposed crack stop can be easily inserted in the die frame with electronic design automation (EDA) tools using a Python interpreter and has the capability to arrest a crack near its initiation point. Conclusions:We show the feasibility of the implementation through EDA tools and outline the next step.

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